A Study of Sputtered TiN Gate Electrode Etching with Various Wet Chemicals and Post Etch Annealing for Complementary Metal–Oxide–Semiconductor Device Integration Applications
2012 ◽
Vol 51
(10R)
◽
pp. 101203
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2012 ◽
Vol 51
◽
pp. 101203
◽
2009 ◽
Vol 48
(1)
◽
pp. 011203
◽
2008 ◽
Vol 145-146
◽
pp. 176-186
◽
2010 ◽
Vol 157
(5)
◽
pp. H546
◽
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