Uniform Performance TFT with Excimer Laser Annealing of Solid Phase Crystallized Poly-Si

Author(s):  
N. Kodama ◽  
H. Tanabe ◽  
K. Sera ◽  
K. Hamada ◽  
S. Saitoh ◽  
...  
MRS Bulletin ◽  
2006 ◽  
Vol 31 (6) ◽  
pp. 461-465 ◽  
Author(s):  
P.C. van der Wilt ◽  
M.G. Kane ◽  
A.B. Limanov ◽  
A.H. Firester ◽  
L. Goodman ◽  
...  

AbstractLow-defect-density polycrystalline Si on flexible substrates can be instrumental in realizing the full potential of macroelectronics. Direct deposition or solid-phase crystallization techniques are often incompatible with polymers and produce materials with high defect densities. Excimer-laser annealing is capable of producing films of reasonable quality directly on polymer and metallic substrates. Sequential lateral solidification (SLS) is an advanced pulsed-laser-crystallization technique capable of producing Si films on polymers with lower defect density than can be obtained via excimer-laser annealing. Circuits built directly on polymers using these SLS films show the highest performance reported to date.


2000 ◽  
Vol 39 (Part 1, No. 9A) ◽  
pp. 5063-5068 ◽  
Author(s):  
Jin-Wook Seo ◽  
Satoru Akiyama ◽  
Yoichiro Aya ◽  
Tomoyuki Nohda ◽  
Hiroki Hamada ◽  
...  

1989 ◽  
Vol 146 ◽  
Author(s):  
Takashi Noguchi ◽  
Kazuhiro Tajima ◽  
Yasushi Morita

ABSTRACTThin silicon films with dendritic large grains can be obtained by Si+ or P+ implantation and subsequent low temperature annealing of the silicon film. We tried further exposing the films with an excimer laser after the grain growth. As a result, improvement of electronic properties such as high carrier mobility or low resistivity were obtained. By TEM observation, polycrystalline grains with a dendritic structure did not melt after laser annealing and it was found that the improvement of electronic properties were achieved mainly due to the improvement of crystallinity by U-V(Ultra-Violet) reflectance, ESR(Electron Spin Resonance) analysis and TFT characteristics. We are convinced that this advanced laser pulse annealing method is an ideal RTA process in the near future and is expected to be applicable to ULSI processes for inter connects, high density stacked SRAM and for large area electronics on glass such as a contact line sensor or LCD(Liquid Crystal Display).


Shinku ◽  
2007 ◽  
Vol 50 (8) ◽  
pp. 527-529
Author(s):  
Naoya KAWAMOTO ◽  
Naoto MATSUO ◽  
Tadaki MIYOSHI ◽  
Akira HEYA

2003 ◽  
Vol 93 ◽  
pp. 161-166
Author(s):  
Koichi Kitahara ◽  
K. Ohnishi ◽  
Y. Katoh ◽  
K. Watakabe ◽  
A. Moritani

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