Structural Properties on GaN Film through the Introduction of AlN Buffer Layers with Variable Growth Temperatures by Plasma-Assisted Molecular Beam Epitaxy
High quality AlN layers with full widths at half maximum values of 10 arcmin and average surface roughness (rms) of 48Å were grown by molecular beam epitaxy on Si(111) substrates. A systematic study and optimization of the growth conditions was performed in order to use these AlN layers as buffers in the growth of GaN films. Atomic force microscopy (AFM) and X-ray diffraction (XRD) techniques were employed to determine the surface and structural quality of the layers. Best AlN films were obtained at high substrate temperatures (Tsubs>900°C) and III/V ratios close to stoichiometry. Growth conditions with III/V ratios beyond stoichiometry (Al-rich) did not further improve the crystal quality. In these cases a higher substrate temperature is needed to prevent condensation of Al on the surface. GaN films with full width at half maximum of 10 arcmin and improved optical properties were grown on top of optimized AlN buffer layers.
Abstract
In this work, the AlN/Si(111) epitaxial structures grown consistently by plasma assisted molecular beam epitaxy (PA MBE) and hydride vapour phase epitaxy (HVPE) methods were studied. The PA MBE AlN buffer layers were synthesized via coalescence overgrowth of self-catalyzed AlN nanocolumns on Si(111) substrates and were used as templates for further HVPE growth of thick AlN layer. It was shown that described approaches can be used to obtain AlN layers with sufficiently smooth morphology. It was found that HVPE AlN inherited crystallographic polarity of the AlN layer grown by PA MBE. It was demonstrated that the etching of such AlN/Si(111) epitaxial structures results in partial separation of the AlN epilayers from the Si(111) substrate and allows to form suspended structures. Moreover, the avoidance of surface damage and backside overetching was achieved by use thin Cr film as surface protective coating and by increasing the layer thickness accordingly.
ABSTRACTThe effects of SiC surface treatment on the lattice relaxation of AlN buffer layers and the crystalline quality of GaN layers grown on the buffer layers were studied. AlN buffer layers and GaN main layers were grown by plasma-assisted molecular-beam epitaxy on on-axis 6H-SiC (0001)Si substrates. High-temperature HCl-gas etching resulted in an atomically flat SiC surface with (√3×√3)R30° surface reconstruction, while HCl-gas etching followed by HF chemical treatment resulted in an atomically flat surface with (1×1) structure. The AlN layer grown on the (1×1) surface showed slower lattice relaxation. GaN grown on the AlN buffer layer exhibited a (0002) X-ray rocking curve of 70 arcsec and 107 cm−2 of screw-type dislocation density, which was superior than that of GaN grown on (√3×√3)R30° surface.
ABSTRACTInN is an important III-V compound semiconductor with many potential microelectronic and optoelectronic applications. In this study, we prepared epitaxial InN on (0001) sapphire with an AlN buffer layer by molecular beam epitaxy, and its variation, migration enhanced epitaxy. A series of samples were grown with different substrate temperatures ranging from 360°C to 590°C. The optimum growth temperature for InN was found to be between 450°C and 500°C. We also found that thicker AlN buffer layers result in the best InN quality. With increasing thickness of an AlN buffer layer, the Hall electron mobility of InN increases while the carrier concentration decreases. The surface morphology is also improved this way. Hall mobility greater than 800 cm2/Vs with carrier concentration 2-3×1018 cm−3 at room temperature can be routinely obtained for ∼0.1[.proportional]m thick InN films. Various InN-based heterostructures with AlInN or AlN barrier were fabricated. X-ray diffraction study clearly shows the barrier and InN layers. A 2-dimensional electron gas resulting from polarization induced electrons was observed in capacitance-voltage measurements. Some results on Mg doping of InN will be discussed as well.
Separation of AlN layers from silicon substrates by KOH etching