Prediction of Critical Temperature and Pressure of Hydrocarbons Using Simple Molecular Properties

2021 ◽  
pp. 130-148
Author(s):  
Kamal I. Al-Malah
Keyword(s):  
Critical Temperature ◽  
Molecular Properties ◽  
Temperature And Pressure

ChemInform Abstract: CRITICAL TEMPERATURE AND PRESSURE OF DECAFLUORO-2-METHYLPROPANE

1982 ◽  
Vol 13 (31) ◽  
Author(s):  
I. A. MCLURE ◽  
A. TREJO RODRIGUEZ ◽  
V. A. M. SOARES
Keyword(s):  
Critical Temperature ◽  
Temperature And Pressure

Two Species/Nonideal Solution Model for Amorphous/Amorphous Phase Transitions

1996 ◽  
Vol 455 ◽  
Author(s):  
Cornelius T. Moynihan
Keyword(s):  
Phase Transition ◽  
Phase Transitions ◽  
Critical Temperature ◽  
Amorphous Phase ◽  
Thermodynamic Model ◽  
Critical Pressure ◽  
Solution Model ◽  
Amorphous Phases ◽  
First Order ◽  
Temperature And Pressure

ABSTRACTA simple macroscopic thermodynamic model for first order transitions between two amorphous phases in a one component liquid is reviewed, augmented and evaluated. The model presumes the existence in the liquid of two species, whose concentrations are temperature and pressure dependent and which form a solution with large, positive deviations from ideality. Application of the model to recent data indicates that water can undergo an amorphous/amorphous phase transition below a critical temperature Tc of 217K and above a critical pressure Pc of 380 atm.

Subcritical and Supercritical Nanodroplet Evaporation: A Molecular Dynamics Investigation

2007 ◽  
Author(s):  
S. Mikkilineni ◽  
E. S. Landry ◽  
A. J. H. McGaughey
Keyword(s):  
Molecular Dynamics ◽  
Critical Temperature ◽  
Critical Pressure ◽  
Ambient Pressure ◽  
Transition Line ◽  
Ambient Temperatures ◽  
Lennard Jones ◽  
Temperature And Pressure ◽  
A New Technique ◽  
Dynamics Simulations

Molecular dynamics simulations are used to investigate the subcritical and supercritical evaporation of a Lennard-Jones (LJ) argon nanodroplet in its own vapor. Using a new technique to control both the ambient temperature and pressure, a range of conditions are considered to define a transition line between subcritical and supercritical evaporation. The evaporation is considered to be supercritical if the surface temperature of the droplet reaches the LJ argon critical temperature during its lifetime. Between ambient temperatures of 300 K and 800 K, the transition from subcritical to supercritical evaporation is observed to occur at an ambient pressure 1.4 times greater than the LJ argon critical pressure. For subcritical conditions, the droplet lifetimes obtained from the simulations are compared to independently predicted lifetimes from the D2 law.

Studies of Temperature and Pressure Dependence in Thermocompression Gold Joints

2005 ◽  
Author(s):  
X. F. Ang ◽  
G. G. Zhang ◽  
J. Wei ◽  
Z. Chen ◽  
C. C. Wong
Keyword(s):  
Shear Strength ◽  
Critical Temperature ◽  
Pressure Dependence ◽  
Bonding Temperature ◽  
Interfacial Stress ◽  
3D Integration ◽  
Bonding Pressure ◽  
Barrier Films ◽  
Linear Rise ◽  
Temperature And Pressure

Low temperature interconnection is a critical component of 3D integration and packaging technology. In this study, we investigate the characteristics of thermocompression metal bonding using gold stud bumps formed on Si die in the temperature range of 100-300 °C and the pressure range of 200–600 g/bump. We observed a critical bonding temperature below which bonding did not occur and above which shear strength improves linearly with bonding temperature. This critical temperature can be interpreted to be the onset of the break-up of organic barrier films while the linear rise in shear strength can be attributed to the increase in the true bonded area. Above this critical temperature, the tensile strength of the Au-Au bond exhibits a maximum with increasing bonding pressure. This can be related to the pressure dependence of the interfacial stress distribution and its effect on unbonded radius, r. SEM fractographs of the failed surfaces suggest a combination of cohesive and adhesive failures along the bonded interface.

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