scholarly journals Comparison of Silicon Die Strength Using Different Loading Anvil Shapes

2021 ◽  
pp. 17-23
Author(s):  
Jefferson Talledo
Keyword(s):  
Statistical Analysis ◽  
Fracture Strength ◽  
Bend Test ◽  
Flexural Stress ◽  
Strength Measurement ◽  
Wedge Shape ◽  
Point Bend Test ◽  
Point Bend ◽  
Strength Characterization ◽  
The Impact

Die fracture strength measurement is important to assess the robustness of a specific silicon die such that it is strong enough to resist die crack. There are several methods used to measure the strength of silicon die and 3-point bend test is the most common. However, the impact of the loading anvil shape on die strength results needs to be investigated. This paper discusses the comparison of die strength characterization using different loading anvil shapes in a 3-point bend test. The anvil shapes considered were wedge shape and needle shape. Die strength calculations were all done using the standard 3-point bend formula for flexural stress. Statistical analysis of the results revealed that die strength measured using wedge shape loading anvil is not significantly different from the strength measured using the needle shape loading anvil. Therefore, using the needle shape loading anvil in a 3-point bend test could still provide die strength results comparable with the results using the standard wedge shape loading anvil.

scholarly journals Fracture Strength Characterization of the Die Active Side and Back Side for a Realistic Die Crack Assessment

2021 ◽  
pp. 84-90
Author(s):  
Jefferson Talledo
Keyword(s):  
Fracture Strength ◽  
Integrated Circuit ◽  
Back Side ◽  
Circuit Layout ◽  
The Common ◽  
Point Bend Test ◽  
The Difference ◽  
Point Bend ◽  
Strength Characterization

This paper discusses the characterization of an integrated circuit (IC) silicon die fracture strength to have a realistic die crack assessment. The evaluation was conducted using a 3-point bend test setup to measure the die strength of actual IC dies. Both the active side and the back side of the IC die were tested for 2 types of dies with different active side circuit layout. Results showed that the difference in the die active side circuit layout or structure has impact on die strength. It was also found that the active side was weaker than the back side. This implies that both the active side and the back side of an actual IC die must be subjected to fracture strength characterization to have an assessment that would be in a better agreement with real condition. Using only the strength of the back side would result in over-estimating the die strength. The common approach of using the fracture strength of the die back side to characterize the die strength is not realistic and can mislead the assessment of die crack or semiconductor package robustness.

scholarly journals Mechanical Performance of Honeycomb Sandwich Structures Using Three-Point Bend Test

2019 ◽  
Vol 9 (2) ◽  
pp. 3955-3958
Author(s):  
T. Subhani
Keyword(s):  
Mechanical Performance ◽  
Sandwich Structures ◽  
Bend Test ◽  
Core Material ◽  
Honeycomb Core ◽  
Adhesive Film ◽  
Honeycomb Sandwich ◽  
Point Bend Test ◽  
Three Point Bend Test ◽  
Point Bend

In this study, honeycomb sandwich structures were prepared and tested. Facesheets of sandwich structures were manufactured by carbon fiber epoxy matrix composites while Nomex® honeycomb was used as core material. An epoxy-based adhesive film was used to bond the composite facesheets with honeycomb core. Four different curing temperatures ranging from 100oC to 130oC were applied with curing times of 2h and 3h. Three-point bend test was performed to investigate the mechanical performance of honeycomb sandwich structures and thus optimize the curing parameters. It was revealed that the combination of a temperature of 110oC along with a curing time of 2h offered the optimum mechanical performance together with low damage in honeycomb core and facesheets.

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