liquid alloy
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Author(s):  
Zsolt Salyi ◽  
George Kaptay ◽  
Daniel Koncz-Horvath ◽  
Laszlo Somlyai-Sipos ◽  
Peter Zoltan Kovacs ◽  
...  

AbstractThe goal of this research is to study the applicability of the diffusion boriding process as a high-temperature thermochemical heat treatment to enhance the lifetime of steel selective soldering tools. The main purpose of the work is to discuss the behavior of double-phase (FeB/Fe2B) iron-boride coating on the surface of different steels (DC04, C45, CK60, and C105U) against the stationary SAC309 lead-free solder liquid alloy. The boride coating was formed on the surface of the steel samples through the powder pack boriding technique. The microstructure of the formed layer was examined by X-ray diffraction (XRD) and scanning electron microscopy (SEM). The borided samples were first cut in half and then immersed into a stationary SAC309 lead-free solder liquid alloy (Sn–3Ag–0.9Cu) for 40 days. Microstructure examinations were performed by SEM with energy-dispersive spectroscopy and an elemental distribution map after the dissolution test. Excessive dissolution/corrosion of the original steel surface was observed at the steel/SAC interfaces, leading also to the formation of Fe–Sn intermetallic phases. This was found to be the major reason for the failure of selective soldering tools made of steel. On the contrary, no dissolution and no intermetallic compounds were observed at the FeB/SAC and at the Fe2B/SAC interfaces; as a result, the thicknesses of the FeB and Fe2B phases remained the same during the 40-day dissolution tests. Thus, it was concluded that both FeB and Fe2B phases show excellent resistance against the aggressive liquid solder alloy. The results of the dissolution tests show a good agreement with the thermodynamic calculations.


Author(s):  
Artur Kudyba ◽  
Wojciech Polkowski ◽  
Grzegorz Bruzda ◽  
Adelajda Polkowska ◽  
Donatella Giuranno
Keyword(s):  

Electronics ◽  
2021 ◽  
Vol 10 (22) ◽  
pp. 2778
Author(s):  
Shipeng Lin ◽  
Jiming Fang ◽  
Tianchen Ye ◽  
Yan Tao ◽  
Shengshun Duan ◽  
...  

Wearable integrated systems that rely on liquid metal commonly require an extremely complicated, high-cost fabrication process, while lacking multiple sensing functions without conductive wires connected to external electronic systems. A multi-sensing wearable patch independent from sophisticated manufacturing method and excessive use of wires has yet to be developed. Herein, we introduce a wireless, battery-free, and skin-attachable patch with multiple sensing capacities, utilizing a low-budget, less time-consuming and design-customizable fabrication method. In an effort to achieve our goal, the general sensing system architecture is promoted, which consists of a semi-liquid alloy Ni-GaIn based strain sensor and a co-designed near-field-communication (NFC) tag integrating thermistor, photoresistor, as well as sensor interface circuits, enabling energy-autonomous power supply and wireless data transmission. In human volunteers, the patch was mounted on the skin surface to demonstrate real-time temperature and light intensity signal monitoring. Further evaluation of body motion capturing involved finger bending and swallowing, demonstrating the feasibility of practical applications in different scenarios. Continuous and simultaneous multi-type signal sensing using the wearable patch should enrich the dimensions of measurements of body response to daily activities, unveiling the potential for remote human health monitoring, advanced human–machine interfaces, and other applications of interest.


2021 ◽  
Vol 50 (6) ◽  
pp. 489-498
Author(s):  
E. N. Sosenushkin ◽  
E. A. Yanovskaya ◽  
T. A. Kinzhaev

Author(s):  
Huifeng Wang ◽  
Yuqian Li ◽  
Yusheng Luo ◽  
Wenlu Yuan ◽  
Xiumin Chen ◽  
...  
Keyword(s):  

2021 ◽  
Vol 39 (3) ◽  
pp. 681-687
Author(s):  
Zygmunt Lipnicki ◽  
Adam W. Bydałek ◽  
Tomasz Małolepszy

Nano Energy ◽  
2021 ◽  
pp. 106237
Author(s):  
Weina Xu ◽  
Xiaobin Liao ◽  
Congli Sun ◽  
Wangwang Xu ◽  
Kangning Zhao ◽  
...  

2021 ◽  
Vol 6 (6) ◽  
pp. 2170034
Author(s):  
Shuo Zhang ◽  
Jiajun Jiang ◽  
Qin Jiang ◽  
Wenjie Fei ◽  
Chuan Fei Guo ◽  
...  
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