Study of the radiation properties of microwave monolithic integrated circuits.

The basic technological processes of production of monolithic integrated circuits of the microwave range in JSC "NPP Istok" named after Shokin are in the focus of the paper. The results of tests of standard products for resistance to the effects of special factors are presented. The main directions of improving the methods of forecasting and assessing resistance to these types of impacts have been developed.

Intracavity antenna for multichannel radiothermograph

The development of an intracavitary multichannel diagnostic radiothermograph based on monolithic integrated circuits will allow creating a medical device that allows diagnosing diseases of internal organs of the human body. Purpose: to consider the option of constructing a diagnostic intracavity antenna with several measurement channels for a multichannel radiothermograph built on the basis of monolithic integrated circuits. A variant of constructing a multichannel radiothermograph for intracavity thermometry, implemented in the form of an intracavity antenna with five channels, a microwave switch and a microwave single-channel radiometer, is proposed. The intracavity antenna allows you to measure the temperature at five points of the biological cavity. The antennas are switched using a multi-channel switch integrated with the microwave radiometer. The conducted theoretical studies confirm the possibility of using multichannel microwave radiometry in medicine for intracavitary thermometry The basis for creating a model of a multichannel microwave radiothermograph based on monolithic integrated circuits for intracavitary examination is laid.

МИНИАТЮРИЗАЦИЯ ПРИЕМО-ПЕРЕДАЮЩИХ МОДУЛЕЙ СВЧ-ДИАПАЗОНА, РЕАЛИЗОВАННЫХ МЕТОДАМИ 3D КРЕМНИЕВОЙ ТЕХНОЛОГИИ

В данной работе приведены современные методики сборки приемо-передающих модулей АФАР при помощи элементов 3D-технологии. Рассмотрены актуальные подходы для снижения массогабаритных характеристик модуля. Проведено численное моделирование и сравнение вариантов, используемых в настоящее время, при разработке сверхкомпактных ППМ сантиметрового и миллиметрового диапазона на основе монолитных интегральных схем. This paper presents modern techniques for assembling transceiver modules AESA using elements of 3D technology. Actual approaches to reducing the overall dimensions of the module have been considered. Numerical modelling and comparison of the options currently used in the development of ultra-compact SMTs of the centimeter and millimeter ranges based on monolithic integrated circuits have been represented.