Measurement of Dielectric and Thermal Properties of Leucaena Leucocephala Bio composite substrate with Different Composition Mixture

The measurements of dielectric and thermal properties for bio composite substrate conducted between the mixture of polypropylene (PP) and saw dust filler Leucaena Leucocephala (150μm). The high temperature Agilent 85070E dielectric probe and Quickline 30 Thermal properties analyser used as an instruments to measure the dielectric properties (εr) and handling temperature of the substrate for frequency range of 1GHz to 20 GHz that are suitable for radio frequency applications. The effect of increasing wood filler indicated that it will raise the DK value from 1.84 to 2.49 and decreases the thermal conductivity behaviour from 0.2 to 0.11w/m.k for all 5 mixture fabricated substrate (PP100, PB9010, PB8020, PB7030 and PB6040). In this research the composition of PP must be greater than the sawdust filler due to PP act as laminating and hold the composite structure. The result presented on this research will useful for planar antenna and microwave filter substrate up to frequency 20 GHz and it could support the technical and vocational education tanning (TVET) learning process that hybrid the knowledge among different field.