Simulation Research for the Effect of KDP Crystal Defect and Initial Internal Stress on Sawing Stress

KDP (KH2PO4) crystal is a kind of excellent nonlinear optical crystals, which has been widely used in nonlinear optical and Inertial Confinement Fusion (ICF) engineering. KDP crystal with the characteristics of low hardness, high brittleness, easy deliquescence and temperature-sensitive is easy to crack during the crystal growth, taken out from crystallizer, and the process of slicing. Stress concentration caused by the initial internal stress redistribution and the growth defect in KDP crystal is an important reason of KDP crystal cracking during sawing process. The numerical simulation model of the KDP crystal containing spherical cavity defect and sawing with fixed abrasive wire saw is established by finite element method in this paper. The effects of initial internal stress, spherical cavity defect on sawing stress are investigated. The maximum tensile stress near the defect during the sawing process is simulated and analyzed. The results show that sawing stress changes smoothly during sawing process, and the fixed abrasive wire saw slicing belongs to low stress cutting way. The sawing stress at sawing kerf is increased obviously. The crystal defect leads to local stress concentration during sawing process. The coupling effect of sawing stress with initial internal stress and the effect of stress concentration are enhanced when the sawing kerf approaches to the defect.

Wire Tension Force Variable Universe Fuzzy Control in Fixed Abrasive Wire Saw Manufacturing

The structural characteristics of the tensioning device in the wire saw manufacturing equipment is introduced. Based on the characteristic of the strainer, the principle of variable universe fuzzy control is adopted to deal with the controlling objects. The design of two stage fuzzy controller and its parameters are discussed. The system simulation shows that the control scheme can make the tension within the stable range.

Experimental Study on Temperature during Wire Saw Slicing

Heat generated during wire saw slicing can cause silicon temperature raise and make silicon wafer warpage, especially for larger silicon wafers. In order to study the wire saw effect on silicon temperature during slicing process, three kinds of wire saw, mainly semi-fixed abrasive wire saw and traditional wire saw, are applied for slicing silicon ingot. In this paper, the thermocouple is used to measure the temperature of the silicon during wire saw slicing. The experiment results show that the temperature of the silicon increases along with the wire saw working direction and reaches maximum value near the outlet position of silicon. The temperature of the silicon sliced by semi-fixed abrasive wire saw is lower than that sliced by traditional wire saw.

Development Evaluation of Mechanical Properties of Brazed Diamond Wire

Fixed-abrasive wire saw, with its ability to cut hard brittle material, such as silicon ingots, crystals and quartz, has emerged as a leading technology for production in semiconductor and photovoltaic industry. There are some defects in conventional fixed-abrasive wire saw such as significant low holding abrasive ability, low machining efficiency, high running costs, etc. A new fixed-abrasive wire, namely brazed diamond wires have been developed to overcome these problems. In this paper, brazed diamond wire were carried out to braze two different size diamond grits onto two different thin steel wires by using a nickel-based powder as brazing alloy. The mechanical properties of brazed diamond wire were evaluated by tensile and breaking twist experiment. The experimental results showed that the heating in the brazing process has litter influence on the wire mechanical properties. The addition of brazed alloy and diamond grits sharply decreased the wire mechanical properties significantly, both in the tensile strength and breaking twist angle. Bigger diamond grit would make the accumulation of brazed alloy which leaded to the deterioration of diameter consistency of wires.