A Large Range Compliant Nano-Manipulator Supporting Electron Beam Lithography

Electron beam lithography (EBL) is an important lithographic process of scanning a focused electron beam (e-beam) to direct write a custom pattern with nanometric accuracy. Due to the very limited field of the focused election beam, a motion stage is needed to move the sample to the e-beam field for processing large patterns. In order to eliminate the stitching error induced by the existing “step and scan” process, we in this paper propose a large range compliant nano-manipulator so that the manipulator and the election beam can be moved in a simultaneous manner. We also present an optimization design for the geometric parameters of the compliant manipulator under the vacuum environment. Experimental results demonstrate 1 mm × 1 mm travel range with high linearity, ~ 0.5% cross-axis error and 5 nm resolution. Moreover, the high natural frequency (~ 56 Hz) of the manipulator facilitates it to achieve high-precision motion of EBL.

Design and analysis of a novel large-range 3-DOF compliant parallel micromanipulator

Compared with the traditional rigid mechanism, the flexible mechanism has more advantages, which play an important role in critical situations such as microsurgery, IC (integrated circuit) fabrication/detection, and some precision operating environment. Especially, there is an increasing need for 3-DOF (degrees-of-freedom) compliant translational micro-platform (CTMP) providing good performance characteristics with large motion range, low cross coupling, and high spatial density. Decoupled topology design of the CTMP can easily realize these merits without increasing the difficulty of controlling. This paper proposes a new three DOF compliant hybrid micromanipulator which have large range of motion up to 100 μm × 100 μm × 100 μm in the direction in the dimension of 90 mm × 90 mm × 50 mm, smaller cross-axis coupling (the max coupling only 2.5%) than the initial XY compliant platform in XY axial.

Design Approach for Reducing Cross-Axis Sensitivity in a Single-Drive Multi-Axis MEMS Gyroscope

In this paper, a new design technique is presented to estimate and reduce the cross-axis sensitivity (CAS) in a single-drive multi-axis microelectromechanical systems (MEMS) gyroscope. A simplified single-drive multi-axis MEMS gyroscope, based on a mode-split approach, was analyzed for cross-axis sensitivity using COMSOL Multiphysics. A design technique named the “ratio-matching method” of drive displacement amplitudes and sense frequency differences ratios was proposed to reduce the cross-axis sensitivity. Initially, the cross-axis sensitivities in the designed gyroscope for x and y-axis were calculated to be 0.482% and 0.120%, respectively, having an average CAS of 0.301%. Using the proposed ratio-matching method and design technique, the individual cross-axis sensitivities in the designed gyroscope for x and y-axis were reduced to 0.018% and 0.073%, respectively. While the average CAS was reduced to 0.045%, showing a reduction rate of 85.1%. Moreover, the proposed ratio-matching method for cross-axis sensitivity reduction was successfully validated through simulations by varying the coupling spring position and sense frequency difference variation analyses. Furthermore, the proposed methodology was verified experimentally using fabricated single-drive multi-axis gyroscope.