Design and analysis of a novel large-range 3-DOF compliant parallel micromanipulator

2021 ◽  
Vol 13 (12) ◽  
pp. 168781402110344
Author(s):  
Jinhai Gao ◽  
Xiaoqiang Han ◽  
Lina Hao ◽  
Ligang Chen
Keyword(s):  
Integrated Circuit ◽  
Degrees Of Freedom ◽  
Large Range ◽  
Topology Design ◽  
Spatial Density ◽  
Integrated Circuit Fabrication ◽  
Circuit Fabrication ◽  
Motion Range ◽  
Large Motion ◽  
Cross Axis

Compared with the traditional rigid mechanism, the flexible mechanism has more advantages, which play an important role in critical situations such as microsurgery, IC (integrated circuit) fabrication/detection, and some precision operating environment. Especially, there is an increasing need for 3-DOF (degrees-of-freedom) compliant translational micro-platform (CTMP) providing good performance characteristics with large motion range, low cross coupling, and high spatial density. Decoupled topology design of the CTMP can easily realize these merits without increasing the difficulty of controlling. This paper proposes a new three DOF compliant hybrid micromanipulator which have large range of motion up to 100 μm × 100 μm × 100 μm in the direction in the dimension of 90 mm × 90 mm × 50 mm, smaller cross-axis coupling (the max coupling only 2.5%) than the initial XY compliant platform in XY axial.

Design and Experimental Testing of an Improved Large-Range Decoupled XY Compliant Parallel Micromanipulator1

2015 ◽  
Vol 7 (4) ◽  
Author(s):  
Jingjun Yu ◽  
Yan Xie ◽  
Zhenguo Li ◽  
Guangbo Hao
Keyword(s):  
Range Of Motion ◽  
Parallel Manipulator ◽  
Large Range ◽  
Experimental Testing ◽  
Experimental Results ◽  
Topology Design ◽  
Motion Range ◽  
Large Motion ◽  
Cross Axis ◽  
Large Improvement

There is an increasing need for XY compliant parallel micromanipulators (CPMs) providing good performance characteristics such as large motion range, well-constrained cross-axis coupling, and parasitic rotation. Decoupled topology design of the CPMs can easily realize these merits without increasing the difficulty of controlling. This paper proposes an improved 4-PP model on the basis of a classical 4-PP model and both of them are selected for manufacturing and testing to verify the effectiveness of the improvement. It has shown from experimental results that there is a large improvement on the performances of improved 4-PP compliant parallel manipulator (CPM): large range of motion up to 5 mm × 5 mm in the unidirection in the dimension of 311 mm × 311 mm × 24 mm, smaller compliance fluctuation (only 36.63% of that of the initial 4-PP model), smaller cross-axis coupling (only 28.10% of that of the initial 4-PP model generated by a single-axis 5 mm actuation), smaller in-plane parasitic yaw (only 57.14% of that of the initial 4-PP model generated by double-axis 5 mm actuation).

Evolution of Stress During Formation of Titanium Disilicide by Rta and Tube Furnace Annealing

1990 ◽  
Vol 202 ◽  
Author(s):  
J.F. Jongste ◽  
O.B. Loopstra ◽  
G.C.A.M. Janssen ◽  
S. Radelaar
Keyword(s):  
Integrated Circuit ◽  
Thermal Processing ◽  
Reaction Rates ◽  
Titanium Disilicide ◽  
Furnace Annealing ◽  
Integrated Circuit Fabrication ◽  
Annealing Step ◽  
Circuit Fabrication ◽  
The Difference ◽  
Processing Steps

Integrated circuit fabrication consists of many processing steps: e.g. lithography, etching, implantation and metallization. Some of these processes are combined with thermal processing. Heat treatments require special attention because previous fabrication steps may be influenced: e.g. dopant profiles may be deteriorated. The amount of interference of an annealing step with a former process is determined by the ratio of the reaction rates (and hence by the difference in activation energies).

An XYZ Parallel Kinematic Flexure Mechanism With Geometrically Decoupled Degrees of Freedom

2011 ◽  
Author(s):  
Shorya Awtar ◽  
John Ustick ◽  
Shiladitya Sen
Keyword(s):  
Degrees Of Freedom ◽  
Element Analysis ◽  
Motion Direction ◽  
Form Analysis ◽  
Flexure Mechanism ◽  
Non Linear ◽  
Decoupled Motion ◽  
Motion Range ◽  
Parallel Kinematic ◽  
Cross Axis

We present the constraint-based design of a novel parallel kinematic flexure mechanism that provides highly decoupled motions along the three translational directions (X, Y, and Z) and high stiffness along the three rotational directions (θx, θy, and θz). The geometric decoupling ensures large motion range along each translational direction and enables integration with large-stroke ground-mounted linear actuators or generators, depending on the application. The proposed design, which is based on a systematic arrangement of multiple rigid stages and parallelogram flexure modules, is analyzed via non-linear finite element analysis. A proof-of-concept prototype of the flexure mechanism is fabricated to validate its large range and decoupled motion capability. The analyses as well as the hardware demonstrate an XYZ motion range of 10 mm × 10 mm × 10 mm. Over this motion range, the non-linear FEA predicts a cross-axis error of less than 3%, parasitic rotations less than 2 mrad, less than 4% lost motion, actuator isolation less than 1.5%, and no perceptible motion direction stiffness variation. Ongoing work includes non-linear closed-form analysis and experimental measurement of these error motion and stiffness characteristics.

A Fresh Insight into Film Morphology Measurement Techniques for Advanced Ulsi Manufacturing

1993 ◽  
Vol 309 ◽  
Author(s):  
Seshadri Ramaswami
Keyword(s):  
Grain Size ◽  
Integrated Circuit ◽  
Measurement Techniques ◽  
Film Morphology ◽  
Integrated Circuit Fabrication ◽  
Circuit Fabrication ◽  
Non Destructive ◽  
Fresh Insight ◽  
Insight Into

AbstractA laser based non-destructive technique has been used to study the morphology of sputterdeposited aluminum alloy films. The data emanating from the Therma-wave Imager that makes use of this principle, has been correlated with reflectivity, grain size and micro-roughness of the film. In addition, through the use of a case study, this paper demonstrates the utility of this application as an in-line monitor in an integrated circuit fabrication line.

An XYZ Parallel-Kinematic Flexure Mechanism With Geometrically Decoupled Degrees of Freedom

2012 ◽  
Vol 5 (1) ◽  
Author(s):  
Shorya Awtar ◽  
John Ustick ◽  
Shiladitya Sen
Keyword(s):  
Degrees Of Freedom ◽  
Finite Elements Analysis ◽  
Motion Direction ◽  
Flexure Mechanism ◽  
Nonlinear Finite Elements ◽  
Decoupled Motion ◽  
Motion Range ◽  
Stiffness Variation ◽  
Parallel Kinematic ◽  
Cross Axis

A novel parallel-kinematic flexure mechanism that provides highly decoupled motions along the three translational directions (X, Y, and Z) and high stiffness along the three rotational directions (θx, θy, and θz) is presented. Geometric decoupling ensures large motion range along each translational direction and enables integration with large-stroke ground-mounted linear actuators or generators, depending on the application. The proposed design, which is based on a systematic arrangement of multiple rigid stages and parallelogram flexure modules, is analyzed via nonlinear finite elements analysis (FEA). A proof-of-concept prototype is fabricated to validate the predicted large range and decoupled motion capabilities. The analysis and the hardware prototype demonstrate an XYZ motion range of 10 mm × 10 mm × 10 mm. Over this motion range, the nonlinear FEA predicts cross-axis errors of less than 7.8%, parasitic rotations less than 10.8 mrad, less than 14.4% lost motion, actuator isolation better than 1.5%, and no perceptible motion direction stiffness variation.

Silicon Rapid Thermal Processing with Ripple Pyrometry

1997 ◽  
Vol 502 ◽  
Author(s):  
A. T. Fiory
Keyword(s):  
Integrated Circuit ◽  
Thermal Processing ◽  
Wide Field ◽  
Loop Control ◽  
Dopant Activation ◽  
Integrated Circuit Fabrication ◽  
Metal Silicides ◽  
Circuit Fabrication ◽  
Infrared Lamps

ABSTRACTThermal processing in silicon integrated circuit fabrication steps for dopant activation, metal silicides, annealing, and oxidation commonly uses single-wafer furnaces that rapidly heat wafers with incandescent infrared lamps. Radiation pyrometers and thermocouple probes are the principle methods of measuring wafer temperature for closed-loop control of rapid thermal processes. The challenge with thermocouples is in dealing with heat from the lamps and non-ideal thermally resistive wafer contact. The challenge with pyrometry is in compensating for the variable emissivity of wafer surfaces and suppressing interference from the lamps. Typical deposited or grown layers of silicon nitride, silicon dioxide, and polycrystalline silicon can produce dramatic changes in emissivity. Layer thicknesses and composition are generally not known with sufficient accuracy, so a method for real time in situ emissivity compensation is required. Accufiber introduced a “ripple technique” to address this issue. The idea is to use two probes, separately sensing radiation from the wafer and the lamps, and extracting AC and quasi-DC parts from each. The AC signals provide a measure of the reflectivity of the wafer, and thence emissivity, as well as the fraction of reflected lamp radiation present in the DC signals. Lucent Technologies introduced a method of using AC lamp ripple to measure wafer temperatures with two radiation probes at a wall in the furnace. One probe views radiation emanating from the wafer through a gap in the lamp array. The other probe has a wide field of view to include lamp radiation. The accuracy of Lucent devices, determined from process results on wafers with various emissivities, is typically in the range of 12°C to 18°C at three standard deviations.

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