Mode Ordering of Single-Drive Multi-Axis MEMS Gyroscope for Reduced Cross-Axis Sensitivity

2021 ◽  
pp. 113145
Author(s):  
Hussamud Din ◽  
Faisal Iqbal ◽  
Byeungleul Lee
Keyword(s):  
Mems Gyroscope ◽  
Cross Axis

scholarly journals Design Approach for Reducing Cross-Axis Sensitivity in a Single-Drive Multi-Axis MEMS Gyroscope

Micromachines ◽  
2021 ◽  
Vol 12 (8) ◽  
pp. 902
Author(s):  
Hussamud Din ◽  
Faisal Iqbal ◽  
Byeungleul Lee
Keyword(s):  
Microelectromechanical Systems ◽  
Reduction Rate ◽  
Design Technique ◽  
Matching Method ◽  
Mems Gyroscope ◽  
Mode Split ◽  
The Cross ◽  
The Individual ◽  
Cross Axis ◽  
Ratio Matching

In this paper, a new design technique is presented to estimate and reduce the cross-axis sensitivity (CAS) in a single-drive multi-axis microelectromechanical systems (MEMS) gyroscope. A simplified single-drive multi-axis MEMS gyroscope, based on a mode-split approach, was analyzed for cross-axis sensitivity using COMSOL Multiphysics. A design technique named the “ratio-matching method” of drive displacement amplitudes and sense frequency differences ratios was proposed to reduce the cross-axis sensitivity. Initially, the cross-axis sensitivities in the designed gyroscope for x and y-axis were calculated to be 0.482% and 0.120%, respectively, having an average CAS of 0.301%. Using the proposed ratio-matching method and design technique, the individual cross-axis sensitivities in the designed gyroscope for x and y-axis were reduced to 0.018% and 0.073%, respectively. While the average CAS was reduced to 0.045%, showing a reduction rate of 85.1%. Moreover, the proposed ratio-matching method for cross-axis sensitivity reduction was successfully validated through simulations by varying the coupling spring position and sense frequency difference variation analyses. Furthermore, the proposed methodology was verified experimentally using fabricated single-drive multi-axis gyroscope.

scholarly journals A Dual-Mass Resonant MEMS Gyroscope Design with Electrostatic Tuning for Frequency Mismatch Compensation

2021 ◽  
Vol 11 (3) ◽  
pp. 1129
Author(s):  
Francesca Pistorio ◽  
Muhammad Mubasher Saleem ◽  
Aurelio Somà
Keyword(s):  
Operating Temperature ◽  
Low Cost ◽  
Resonant Mode ◽  
Silicon On Insulator ◽  
Micro Electro Mechanical Systems ◽  
Mems Gyroscope ◽  
Sensing Applications ◽  
Frequency Mismatch ◽  
Mechanical Spring ◽  
Cross Axis

The micro-electro-mechanical systems (MEMS)-based sensor technologies are considered to be the enabling factor for the future development of smart sensing applications, mainly due to their small size, low power consumption and relatively low cost. This paper presents a new structurally and thermally stable design of a resonant mode-matched electrostatic z-axis MEMS gyroscope considering the foundry constraints of relatively low cost and commercially available silicon-on-insulator multi-user MEMS processes (SOIMUMPs) microfabrication process. The novelty of the proposed MEMS gyroscope design lies in the implementation of two separate masses for the drive and sense axis using a unique mechanical spring configuration that allows minimizing the cross-axis coupling between the drive and sense modes. For frequency mismatch compensation between the drive and sense modes due to foundry process uncertainties and gyroscope operating temperature variations, a comb-drive-based electrostatic tuning is implemented in the proposed design. The performance of the MEMS gyroscope design is verified through a detailed coupled-field electric-structural-thermal finite element method (FEM)-based analysis.

A two degrees of freedom comb capacitive-type accelerometer with low cross-axis sensitivity

2019 ◽  
Vol 13 (3) ◽  
pp. 5334-5346
Author(s):  
M. N. Nguyen ◽  
L. Q. Nguyen ◽  
H. M. Chu ◽  
H. N. Vu
Keyword(s):  
Degrees Of Freedom ◽  
Proof Mass ◽  
Vibration Modes ◽  
Electrode Structure ◽  
Element Analysis ◽  
Mechanical Coupling ◽  
Fully Differential ◽  
Mode Effects ◽  
The Finite Element Analysis ◽  
Cross Axis

In this paper, we report on a SOI-based comb capacitive-type accelerometer that senses acceleration in two lateral directions. The structure of the accelerometer was designed using a proof mass connected by four folded-beam springs, which are compliant to inertial displacement causing by attached acceleration in the two lateral directions. At the same time, the folded-beam springs enabled to suppress cross-talk causing by mechanical coupling from parasitic vibration modes. The differential capacitor sense structure was employed to eliminate common mode effects. The design of gap between comb fingers was also analyzed to find an optimally sensing comb electrode structure. The design of the accelerometer was carried out using the finite element analysis. The fabrication of the device was based on SOI-micromachining. The characteristics of the accelerometer have been investigated by a fully differential capacitive bridge interface using a sub-fF switched-capacitor integrator circuit. The sensitivities of the accelerometer in the two lateral directions were determined to be 6 and 5.5 fF/g, respectively. The cross-axis sensitivities of the accelerometer were less than 5%, which shows that the accelerometer can be used for measuring precisely acceleration in the two lateral directions. The accelerometer operates linearly in the range of investigated acceleration from 0 to 4g. The proposed accelerometer is expected for low-g applications.

Yaw/Heading Optimization by Drift Elimination on MEMS Gyroscope

2021 ◽  
pp. 112691
Author(s):  
Minh Long Hoang ◽  
Antonio Pietrosanto
Keyword(s):  
Mems Gyroscope

scholarly journals Design and optimization of differential capacitive micro accelerometer for vibration measurement

2021 ◽  
Vol 30 (1) ◽  
pp. 19-27
Author(s):  
Kumar Gomathi ◽  
Arunachalam Balaji ◽  
Thangaraj Mrunalini
Keyword(s):  
Software Design ◽  
Proof Mass ◽  
Vibration Measurement ◽  
Design Parameters ◽  
Mechanical Sensitivity ◽  
Design And Optimization ◽  
Capacitive Accelerometer ◽  
Cross Axis ◽  
Micro Accelerometer

Abstract This paper deals with the design and optimization of a differential capacitive micro accelerometer for better displacement since other types of micro accelerometer lags in sensitivity and linearity. To overcome this problem, a capacitive area-changed technique is adopted to improve the sensitivity even in a wide acceleration range (0–100 g). The linearity is improved by designing a U-folded suspension. The movable mass of the accelerometer is designed with many fingers connected in parallel and suspended over the stationary electrodes. This arrangement gives the differential comb-type capacitive accelerometer. The area changed capacitive accelerometer is designed using Intellisuite 8.6 Software. Design parameters such as spring width and radius, length, and width of the proof mass are optimized using Minitab 17 software. Mechanical sensitivity of 0.3506 μm/g and Electrical sensitivity of 4.706 μF/g are achieved. The highest displacement of 7.899 μm is obtained with a cross-axis sensitivity of 0.47%.

scholarly journals A Combined Method for MEMS Gyroscope Error Compensation Using a Long Short-Term Memory Network and Kalman Filter in Random Vibration Environments

Sensors ◽  
2021 ◽  
Vol 21 (4) ◽  
pp. 1181
Author(s):  
Chenhao Zhu ◽  
Sheng Cai ◽  
Yifan Yang ◽  
Wei Xu ◽  
Honghai Shen ◽  
...  
Keyword(s):  
Kalman Filter ◽  
Standard Deviation ◽  
Error Compensation ◽  
Random Vibration ◽  
Short Term Memory ◽  
Combined Method ◽  
Short Term ◽  
Mems Gyroscope ◽  
Long Short Term Memory ◽  
Lstm Network

In applications such as carrier attitude control and mobile device navigation, a micro-electro-mechanical-system (MEMS) gyroscope will inevitably be affected by random vibration, which significantly affects the performance of the MEMS gyroscope. In order to solve the degradation of MEMS gyroscope performance in random vibration environments, in this paper, a combined method of a long short-term memory (LSTM) network and Kalman filter (KF) is proposed for error compensation, where Kalman filter parameters are iteratively optimized using the Kalman smoother and expectation-maximization (EM) algorithm. In order to verify the effectiveness of the proposed method, we performed a linear random vibration test to acquire MEMS gyroscope data. Subsequently, an analysis of the effects of input data step size and network topology on gyroscope error compensation performance is presented. Furthermore, the autoregressive moving average-Kalman filter (ARMA-KF) model, which is commonly used in gyroscope error compensation, was also combined with the LSTM network as a comparison method. The results show that, for the x-axis data, the proposed combined method reduces the standard deviation (STD) by 51.58% and 31.92% compared to the bidirectional LSTM (BiLSTM) network, and EM-KF method, respectively. For the z-axis data, the proposed combined method reduces the standard deviation by 29.19% and 12.75% compared to the BiLSTM network and EM-KF method, respectively. Furthermore, for x-axis data and z-axis data, the proposed combined method reduces the standard deviation by 46.54% and 22.30% compared to the BiLSTM-ARMA-KF method, respectively, and the output is smoother, proving the effectiveness of the proposed method.

scholarly journals A high-frequency non-resonant elliptical vibration-assisted cutting device for diamond turning microstructured surfaces

2021 ◽  
Vol 112 (11-12) ◽  
pp. 3247-3261
Author(s):  
Zhengjian Wang ◽  
Xichun Luo ◽  
Haitao Liu ◽  
Fei Ding ◽  
Wenlong Chang ◽  
...  
Keyword(s):  
Heat Generation ◽  
High Frequency ◽  
Diamond Turning ◽  
Coupling Ratio ◽  
Modal Characteristics ◽  
Elliptical Vibration ◽  
Microstructured Surfaces ◽  
Operational Frequency ◽  
The Cross ◽  
Cross Axis

AbstractIn recent years, research has begun to focus on the development of non-resonant elliptical vibration-assisted cutting (EVC) devices, because this technique offers good flexibility in manufacturing a wide range of periodic microstructures with different wavelengths and heights. However, existing non-resonant EVC devices for diamond turning can only operate at relatively low frequencies, which limits their machining efficiencies and attainable microstructures. This paper concerns the design and performance analysis of a non-resonant EVC device to overcome the challenge of low operational frequency. The structural design of the non-resonant EVC device was proposed, adopting the leaf spring flexure hinge (LSFH) and notch hinge prismatic joint (NHPJ) to mitigate the cross-axis coupling of the reciprocating displacements of the diamond tool and to combine them into an elliptical trajectory. Finite element analysis (FEA) using the mapped meshing method was performed to assist the determination of the key dimensional parameters of the flexure hinges in achieving high operational frequency while considering the cross-axis coupling and modal characteristics. The impact of the thickness of the LSFH on the sequence of the vibrational mode shape for the non-resonant EVC device was also quantitatively revealed in this study. Moreover, a reduction in the thickness of the LSFH can reduce the natural frequency of the non-resonant EVC device, thereby influencing the upper limit of its operational frequency. It was also found that a decrease in the neck thickness of the NHPJ can reduce the coupling ratio. Experimental tests were conducted to systematically evaluate the heat generation, cross-axis coupling, modal characteristics and diamond tool’s elliptical trajectory of a prototype of the designed device. The test results showed that it could operate at a high frequency of up to 5 kHz. The cross-axis coupling ratio and heat generation of the prototype are both at an acceptable level. The machining flexibility and accuracy of the device in generating microstructures of different wavelengths and heights through tuning operational frequency and input voltage have also been demonstrated via manufacturing the micro-dimple arrays and two-tier microstructured surfaces. High-precision microstructures were obtained with 1.26% and 10.67% machining errors in wavelength and height, respectively.

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