microchannel devices
Recently Published Documents


TOTAL DOCUMENTS

33
(FIVE YEARS 1)

H-INDEX

12
(FIVE YEARS 0)

2015 ◽  
Vol 25 (2) ◽  
pp. 027003
Author(s):  
Paul J Hymel ◽  
D S Guan ◽  
Yang Mu ◽  
W J Meng ◽  
Andrew C Meng

Lab on a Chip ◽  
2015 ◽  
Vol 15 (8) ◽  
pp. 1942-1951 ◽  
Author(s):  
Sean Collignon ◽  
James Friend ◽  
Leslie Yeo

Open droplet microfluidic platforms offer attractive alternatives to closed microchannel devices, including lower fabrication cost and complexity, significantly smaller sample and reagent volumes, reduced surface contact and adsorption, as well as drop scalability, reconfigurability, and individual addressability.


2014 ◽  
Vol 88 ◽  
pp. 148-155
Author(s):  
Charles Lewinsohn ◽  
Joseph Fellows ◽  
Merrill Wilson

Many energy conversion systems use thermal processes to convert chemical energy to mechanical or electrical energy. In these situations, microchannel components can be used to make heat exchangers and microreactors to make processes more energy efficient. Ceramic heat exchangers permit operation at higher temperatures than with other materials. Additionally, compact heat exchangers are highly efficient and cost-effective. This talk will describe principles of design, methods of fabrication, and joining methods for ceramic, compact heat exchangers for integration of such heat exchangers into practical applications. Particular emphasis will be placed on methods for joining silicon carbide to itself and the results of a novel bonding method that can be performed art relatively low temperatures in air. The mechanical behavior, at room temperature and elevated temperature, of this bonding method will be compared to that of diffusion bonded joints.


2014 ◽  
Vol 14 (8) ◽  
pp. 2725-2730 ◽  
Author(s):  
Salvatore Andrea Pullano ◽  
Syed Kamrul Islam ◽  
Antonino S. Fiorillo

2013 ◽  
Vol 91 (10) ◽  
pp. 1941-1953 ◽  
Author(s):  
Koon F. Lam ◽  
Eva Sorensen ◽  
Asterios Gavriilidis

Sign in / Sign up

Export Citation Format

Share Document