Characteristics and Performance of Microstrip Patch antenna for C Band and X Band

This article present a compact proposed patch antenna for impedance matched for simple two horizontal slot is placed in a active patch with a via hole in sandwiched between radiated patch and bottom plane of an microstrip patch antenna for a band of 4 to 12Ghz application. The planned antenna is synthesized by using glass reinforced epoxy laminated material (FR4) and electromagnetic 3D view (IE3D) software. The software based design is suitable for a band of 3.3//5.5 Wi-Max and 5.3/5.8 WLAN frequency band. It is also suitable for satellite application The ground and exciting patch is separated by 1.5mm thickness. The proposed antenna parameter is design for 10Ghz..For such design the achieved Bandwidth for an antenna is 53 % at a VSWR<2, acceptable return loss (S11) = - 22.5dB, and the directivity of an antenna is 6 dBi. The antenna is appropriate for an application of X band. The designs of an antenna and its result have been discussed in detail.

Mechanical and Dielectric Strength of Laminated Epoxy Dielectric Graded Materials

Laminated epoxy dielectric graded material is a commonly used insulating material with broad application prospects in power equipment. The interlaminar interfaces of laminated epoxy dielectric material between different layers form during its lamination process, and these interfaces are the crucial characteristic structures determining the mechanical and dielectric properties of laminated materials. Therefore, in order to gain a thorough understanding of physic properties behind a certain structural motif, it is necessary to study how these interfacial structures influence the mechanical and dielectric performances of graded materials. In this study, double-layered epoxy resin samples with an interlaminar interface are prepared to study their mechanical and dielectric strength. More importantly, the formation mechanism of the interface, as well as its influence on the mechanical and dielectric strength of this laminated material, is discussed. We found that a cross-linking reaction may take place between epoxy resins at the interlaminar interface, and the degree of cross-linking at the interface should be less than that in the bulk. The mechanical strength of the interlaminar interface is weaker than that of the bulk, and it is reduced by less than 40%. Moreover, the interlaminar interface is inclined to trap carriers, which improves the breakdown strength and arc ablation resistance of the laminated material. Our study of interlaminar interface properties could help in designing epoxy dielectric graded materials with better mechanical and dielectric properties.