Thermal management of electronic systems is the utmost concern to achieve optimum efficiency under space and weight constraints. For the optimal functioning of a system, the heat generated by the electronic components needs to be dissipated efficiently. The passive cooling technique is extensively used in electronic systems, wherein the more contact surface area of a heat source and the surroundings are utilized. This paper focuses on mathematical and simulation analysis for different types of heat sink designs for the 30 W multi-output DC–DC converter. Heat sink with inverted trapezoidal fins has resulted in efficient thermal management of the converter at its safe operating temperature of 398 K. Results show that the maximum temperature attained by the converter was 352 K which was in the safe operating zone of the converter. A comparative study of the effectiveness of heat dissipation with respect to maximum temperature attained has been discussed. Mathematical verification of Rayleigh number for different heat sink designs has also been carried out for its critical value.
Preliminary Test of Thermionic Converter/Heat Pipe Assembly
