Mathematical and simulation analysis of natural convection heat transfer for DC–DC converter

Author(s):  
Vipan Kumar ◽  
Harry Garg ◽  
Chetandeep Singh ◽  
Sucheta Kandoria ◽  
Vinod Karar

Thermal management of electronic systems is the utmost concern to achieve optimum efficiency under space and weight constraints. For the optimal functioning of a system, the heat generated by the electronic components needs to be dissipated efficiently. The passive cooling technique is extensively used in electronic systems, wherein the more contact surface area of a heat source and the surroundings are utilized. This paper focuses on mathematical and simulation analysis for different types of heat sink designs for the 30 W multi-output DC–DC converter. Heat sink with inverted trapezoidal fins has resulted in efficient thermal management of the converter at its safe operating temperature of 398 K. Results show that the maximum temperature attained by the converter was 352 K which was in the safe operating zone of the converter. A comparative study of the effectiveness of heat dissipation with respect to maximum temperature attained has been discussed. Mathematical verification of Rayleigh number for different heat sink designs has also been carried out for its critical value.

Author(s):  
Zhuo Cui

This paper presents the effects of heat dissipation performance of pin fins with different heat sink structures. The heat dissipation performance of two types of pin fin arrays heat sink are compared through measuring their heat resistance and the average Nusselt number in different cooling water flow. The temperature of cpu chip is monitored to determine the temperature is in the normal range of working temperature. The cooling water flow is in the range of 0.02L/s to 0.15L/s. It’s found that the increase of pin fins in the corner region effectively reduce the temperature of heat sink and cpu chip. The new type of pin fin arrays increase convection heat transfer coefficient and reduce heat resistance of heat sink.


2017 ◽  
Author(s):  
◽  
Chengyi Gu

With the rapid miniaturization of the electronic systems, heat generation in the components becomes a major concern for thermal management. The high density of heat generation can be a bottleneck to attain higher performance and reliability of computers. Because conventional cooling methods such as finned heat sink are often incapable of providing adequate cooling for sophisticated electronic systems, new systems like heat pipes or liquid cooling systems are being studied. This work focused on the novel design of a liquid metal and heat sink cooling loop targeted for laptop computer thermal management. The liquid metal was driven by an electromechanical pump, offering no moving parts and quiet operation. To better understand the design process, theoretical analysis for fluid flow and heat transfer performance of liquid metal and heat sink are conducted. Furthermore, in order to demonstrate the feasibility of this new concept, a series of experiments on the fabricated module under different heater powers and pump power are performed. A thermal resistance value of 0.53 ?/W was experimentally determined, making the performance similar to competing technologies. Performance was impeded by a low pump efficiency, a known impediment with electromagnetic pumps.


2019 ◽  
Vol 814 ◽  
pp. 307-313
Author(s):  
Gu Yu Yu ◽  
Sum Wai Chiang ◽  
Wei Chen ◽  
Hong Da Du

A novel thermal management system (TMS) for Li-ion battery module using phase change material (PCM) and cooling water as the heat dissipation source to control battery temperature rise has been developed. Graphite sheets were applied to compensate low thermal conductivity of battery and PCM and improve temperature uniformity of the batteries. One discharge (1C rate)-charge (2C rate) circle was applied in battery modules to test the effectiveness of this TMS. A three dimensional numerical model of the battery module with the TMS was conducted. The results show that this TMS basically meets the demand about the maximum temperature difference of battery module and totally keeps the maximum temperature within the optimum operating temperature range (≤45°C).


2019 ◽  
Vol 23 (5 Part B) ◽  
pp. 3129-3141
Author(s):  
Senthil Pongiannan ◽  
Velraj Ramalingam ◽  
Latha Nagendran

The high power density and compactness of the next generation electronic devices necessitate efficient and effective cooling methods for heat dissipation in order to maintain the temperature at an acceptable safety level. In the present work, aluminum nanocoating was employed in a heat sink to study the heat transfer performance under natural-convection conditions. The nanocoating was achieved using an electron beam method while the characteristics of nanocoated surfaces were analysed using SEM, an energy dispersive X-ray spectroscopy, surface roughness profilometry equipment and by X-ray diffraction techniques. The heat dissipation from heat sink with and without nanocoating under natural-convection has been experimentally studied at different controllable surrounding temperatures. A uniform increase in the surface roughness by the nanocoating was seen in all cases. The conclusion from several experimental results was that the effect of nanocoating in augmenting the heat transfer is more pronounced only when there is a sufficient temperature driving potential.


Energies ◽  
2021 ◽  
Vol 14 (3) ◽  
pp. 782
Author(s):  
Bin Li ◽  
Zheng Cui ◽  
Qun Cao ◽  
Wei Shao

As the heat flux of electronic components is increasing rapidly, the traditional air-cooling technique is gradually not meeting the requirements of thermal management. The immersion liquid-cooling technique shows great potential, and has attracted increasing attention due to its excellent performance in recent years. The finned heat sink is common and essential for cooling electric components. To analyze the influences of its structural parameters on heat dissipation and improve its efficiency while using a dielectric coolant, this study used the orthogonal analysis method to obtain the optimal structure via the numerical simulation method. The maximum temperature of the heat sink was selected as the evaluation criteria. The results showed that the parameters that affect the maximum temperature, in order of importance, are fin thickness, the number of fins, the height of the fins, and substrate thickness. Finally, taking the maximum temperature and mass as indexes obtained the optimal structure of the heat sink. The mass was reduced by 19%, while the temperature only increased by 4.5% when considering the mass index.


2021 ◽  
Vol 2108 (1) ◽  
pp. 012093
Author(s):  
Jibao Liu ◽  
Huanyong Cui ◽  
Lei Gao ◽  
Jiangtao Wang ◽  
Meiyan Wang ◽  
...  

Abstract The working principle and advantages of proton exchange membrane fuel cell using renewable energy hydrogen as fuel are introduced, the importance of fuel cell thermal management is emphasized, and the performance influencing factors, heat source and design requirements of proton exchange membrane fuel cell are summarized. According to the current research status of fuel cell related thermal management, the methods of simulation analysis of fuel cell with the help of mathematical model are summarized, and the existing problems and solutions of fuel cell heat dissipation and cold start are summarized.


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