An Analysis Of Void Nucleation In Passivated Interconnect Lines Due To Vacancy Condensation And Interface Contamination

Nucleation of voids due to vacancy condensation in passivated aluminum lines is analyzed within the context of classical nucleation theory. A discussion of sources of hydrostatic tensile stress in such lines provides a reasonable upper limit of 2 GPa. The void nucleation rate is then calculated at various sites within the line. Results suggest that nucleation rates are far too low to account for observed rates of voiding. Void nucleation at a flaw at the line/passivation interface is then considered as an alternative nucleation mechanism. Such flaws may be created by contaminants introduced during fabrication of the line. In this case, nucleation is feasible at greatly reduced stresses, well within the observed values. Furthermore, a simple model of void growth indicates that a fast atomic transport path, such as a grain boundary, must intersect the void for an appreciable growth rate. These results suggest that void nucleation in aluminum interconnect lines occurs at flaws at the sidewall of the line and that stress-induced and electromigration-induced voiding can be controlled by eliminating interfacial contamination.

An Analysis of Void Nucleation In Passivated Interconnect Lines Due to Vacancy Condensation and Interface Contamination

Nucleation of voids due to vacancy condensation in passivated aluminum lines is analyzed within the context of classical nucleation theory. A discussion of sources of hydrostatic tensile stress in such lines provides a reasonable upper limit of 2 GPa. The void nucleation rate is then calculated at various sites within the line. Results suggest that nucleation rates are far too low to account for observed rates of voiding. Void nucleation at a flaw at the line/passivation interface is then considered as an alternative nucleation mechanism. Such flaws may be created by contaminants introduced during fabrication of the line. In this case, nucleation is feasible at greatly reduced stresses, well within the observed values. Furthermore, a simple model of void growth indicates that a fast atomic transport path, such as a grain boundary, must intersect the void for an appreciable growth rate. These results suggest that void nucleation in aluminum interconnect lines occurs at flaws at the sidewall of the line and that stress-induced and electromigration-induced voiding can be controlled by eliminating interfacial contamination.

Internal Strain (Stress) in an Sic/Al Particle-Reinforced Composite

Silicon carbide and 6061 aluminum alloy possess very different thermalexpansion coefficients; 3-3 and 22.5.10-6K-1, respectively. Thus, one expects large internal strains and stresses in these composites because the two constituents form interfacial bonds at high temperatures and are cooled to ambient temperatures. From a simple elastic model, one expects a hydrostatic tensile stress in the aluminum matrix and a-hydrostatic compressive stress in the silicon-carbide particles. Using conventional diffraction geometry, using Cu Kα radiation, we studied three surfaces of a plate specimen. For both phases, we determined the unit-cell dimensions for two situations: unmixed and mixed in the final composite. The silicon-carbide particles showed a compressive stress and the aluminum matrix a tensile stress, seventy-five percent of the yield strength. Measurements show that both stress tensors are approximately hydrostatic.

673K Embrittlement of Ferritic Spheroidal Graphite Cast Iron

ABSTRACTIntergranular fracture had been observed in the temperature range from 573K – 673K, where the ductilit miniTum appears at 673K for the strain rate of sec−1 in ferritic spheroidal graphite cast irons.The cause of intergranular fracture at about 673K has been investigated. The following two points are emphasized. The first is the role of hydrostatic tensile stress in triaxial stress field developed in ferrite matrix among graphite nodules, relating to the effect of graphite volume fraction on the intergranular fracture. The second is the role of carbide precipitation during dynamic strain ageing, relating to the strain rate and the temperature dependence of the intergranular fracture.