Progress in Adhesion and Adhesives
Latest Publications

TOTAL DOCUMENTS

11

(FIVE YEARS 11)

H-INDEX

0

(FIVE YEARS 0)

Published By Wiley

9781119625254, 9781119625322

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Dispersion Adhesion Forces between Macroscopic Objects–Basic Concepts and Modelling Techniques: A Critical Review

Progress in Adhesion and Adhesives ◽

10.1002/9781119625322.ch9 ◽

2019 ◽

pp. 421-442

Author(s):

Youcef Djafri ◽

Djamel Turki

Keyword(s):

Critical Review ◽

Adhesion Forces ◽

Modelling Techniques ◽

Macroscopic Objects ◽

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Contact Angle Measurements and Applications in Pharmaceuticals and Foods: A Critical Review

Progress in Adhesion and Adhesives ◽

10.1002/9781119625322.ch5 ◽

2019 ◽

pp. 193-240

Author(s):

Davide Rossi ◽

Davide Rossi ◽

Paola Pittia ◽

Nicola Realdon

Keyword(s):

Contact Angle ◽

Critical Review ◽

Angle Measurements ◽

Contact Angle Measurements

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Surface Free Energy Determination of Powders and Particles with Pharmaceutical Applications: A Critical Review

Progress in Adhesion and Adhesives ◽

10.1002/9781119625322.ch7 ◽

2019 ◽

pp. 315-352

Author(s):

Frank M. Etzler ◽

Douglas Gardner

Keyword(s):

Free Energy ◽

Surface Free Energy ◽

Critical Review ◽

Pharmaceutical Applications ◽

Energy Determination

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The Formation Processes of Functional Groups at Polyolefin Surfaces on Exposure to Oxygen or Ammonia Plasma: A Critical Review

Progress in Adhesion and Adhesives ◽

10.1002/9781119625322.ch6 ◽

2019 ◽

pp. 241-313

Author(s):

Jörg Friedrich

Keyword(s):

Functional Groups ◽

Critical Review ◽

Formation Processes ◽

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Adhesion between Compounded Elastomers: A Critical Review

Progress in Adhesion and Adhesives ◽

10.1002/9781119625322.ch4 ◽

2019 ◽

pp. 99-191

Author(s):

K. Dinesh Kumar ◽

M.S. Satyanarayana ◽

Ganesh C. Basak ◽

Anil K. Bhowmick

Keyword(s):

Critical Review

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Adhesion Phenomena Pertaining to Thermal Interface Materials and Solder Interconnects in Microelectronic Packaging: A Critical Review

Progress in Adhesion and Adhesives ◽

10.1002/9781119625322.ch1 ◽

2019 ◽

pp. 1-24

Author(s):

Dinesh P R Thanu ◽

Aravindha Antoniswamy ◽

Roozbeh Danaei ◽

Manish Keswani

Keyword(s):

Critical Review ◽

Microelectronic Packaging ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Solder Interconnects ◽

Interface Materials

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Front Matter

Progress in Adhesion and Adhesives ◽

10.1002/9781119625322.fmatter ◽

2019 ◽

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Understanding Wood Bonds–Going Beyond What Meets the Eye: A Critical Review

Progress in Adhesion and Adhesives ◽

10.1002/9781119625322.ch8 ◽

2019 ◽

pp. 353-419

Author(s):

Christopher G. Hunt ◽

Charles R. Frihart ◽

Manfred Dunky ◽

Anti Rohumaa

Keyword(s):

Critical Review

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Also of Interest

Progress in Adhesion and Adhesives ◽

10.1002/9781119625322.pubnote ◽

2019 ◽

pp. 443-444

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Recent Advances in Adhesively Bonded Lap Joints Having Bi‐Adhesive and Modulus‐Graded Bondlines: A Critical Review

Progress in Adhesion and Adhesives ◽

10.1002/9781119625322.ch3 ◽

2019 ◽

pp. 77-97

Author(s):

Özkan Öz ◽

Halil Özer

Keyword(s):

Critical Review ◽

Adhesively Bonded ◽

Recent Advances

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