2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)
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9781479983629, 9781479983643
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Signal integrity improvement with peripherally placed MWCNTs in mixed CNT bundle based TSVs

2015 ◽  
Author(s):  
Manoj Kumar Majumder ◽  
Archana Kumari ◽  
Arsalan Alam ◽  
Vobulapuram Ramesh Kumar ◽  
Brajesh Kumar Kaushik
Keyword(s):  
Signal Integrity

scholarly journals Off-state breakdown characteristics of AlGaN/GaN MIS-HEMTs for switching power applications

2015 ◽  
Author(s):  
Gilberto Curatola ◽  
Martin Huber ◽  
Ingo Daumiller ◽  
Oliver Haeberlen ◽  
Giovanni Verzellesi
Keyword(s):  
Switching Power ◽  
State Breakdown

TSV-based PUF circuit for 3DIC sensor nodes in IoT applications

2015 ◽  
Author(s):  
Chao Wang ◽  
Jun Zhou ◽  
Katti Guruprasad ◽  
Xin Liu ◽  
Roshan Weerasekera ◽  
...  
Keyword(s):  
Sensor Nodes ◽  
Iot Applications

Characteristic of arrayed flexible glucose biosensor integrated with the microfluidic device

2015 ◽  
Author(s):  
Ruei-Ting Chen ◽  
Yi-Hung Liao ◽  
Min-Siang Huang ◽  
Jung-Chuan Chou ◽  
Jian-Syun Chen ◽  
...  
Keyword(s):  
Microfluidic Device ◽  
Glucose Biosensor
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