[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium
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A clarification of the adiabatic heat transfer coefficient as applied to convective cooling of electronics

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1992.172842 ◽

2003 ◽

Cited By ~ 5

Author(s):

A. Ortega ◽

B.S. Lall

Keyword(s):

Heat Transfer ◽

Heat Transfer Coefficient ◽

Transfer Coefficient ◽

Convective Cooling ◽

Cooling Of Electronics

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The application of two-phase push-pull cooling module in pin-fin array electronic device

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1992.172844 ◽

2003 ◽

Cited By ~ 1

Author(s):

Chao Yu-Lin ◽

Chao Fang-Lin

Keyword(s):

Electronic Device ◽

Two Phase ◽

Pin Fin ◽

Cooling Module ◽

Pin Fin Array

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Thermal analysis and modelling of a copper-polyimide thin-film-on-silicon multichip module packaging technology

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1992.172857 ◽

2003 ◽

Cited By ~ 5

Author(s):

D.W. Snyder

Keyword(s):

Thin Film ◽

Thermal Analysis ◽

Multichip Module ◽

Packaging Technology

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Determination of appropriate thermal transport properties for electronics applications

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1992.172865 ◽

2003 ◽

Author(s):

R.P. Tye ◽

A. Maesono

Keyword(s):

Transport Properties ◽

Thermal Transport ◽

Thermal Transport Properties

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Thermal performance of power packages-single-inline package as a case study

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1992.172855 ◽

2003 ◽

Cited By ~ 2

Author(s):

B. Chambers ◽

M. Mahilingam

Keyword(s):

Thermal Performance

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F/sub opt/-a thermal optimization factor for microelectronic packages

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1992.172856 ◽

2003 ◽

Cited By ~ 1

Author(s):

T.F. Lemczyk ◽

J.R. Culham ◽

S. Lee ◽

M.M. Yovanovich

Keyword(s):

Thermal Optimization ◽

Microelectronic Packages

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A comparison of two-dimensional planar, axisymmetric and three-dimensional spreading resistances

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1992.172852 ◽

2003 ◽

Cited By ~ 13

Author(s):

D.J. Nelson ◽

W.A. Sayers

Keyword(s):

Three Dimensional ◽

Two Dimensional

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A thermal evaluation of multichip module (MCM) materials and designs

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1992.172858 ◽

2003 ◽

Cited By ~ 2

Author(s):

M.A. Kuhlman ◽

H. Sehitoglu

Keyword(s):

Multichip Module

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Thermal analysis of a substrate with power dissipation in the vias

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1992.172853 ◽

2003 ◽

Cited By ~ 6

Author(s):

R.A. Brewster ◽

R.A. Sherif

Keyword(s):

Thermal Analysis ◽

Power Dissipation

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Simulation of electrothermal interactions in power integrated circuits

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1992.172854 ◽

2003 ◽

Cited By ~ 6

Author(s):

L. Hebrard ◽

G. Jacquemod ◽

B. Boutherin ◽

M. Le Helley

Keyword(s):

Integrated Circuits

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[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management SymposiumLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A clarification of the adiabatic heat transfer coefficient as applied to convective cooling of electronics

The application of two-phase push-pull cooling module in pin-fin array electronic device

Thermal analysis and modelling of a copper-polyimide thin-film-on-silicon multichip module packaging technology

Determination of appropriate thermal transport properties for electronics applications

Thermal performance of power packages-single-inline package as a case study

F/sub opt/-a thermal optimization factor for microelectronic packages

A comparison of two-dimensional planar, axisymmetric and three-dimensional spreading resistances

A thermal evaluation of multichip module (MCM) materials and designs

Thermal analysis of a substrate with power dissipation in the vias

Simulation of electrothermal interactions in power integrated circuits

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Latest Publications