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Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.
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TOTAL DOCUMENTS
65
(FIVE YEARS 0)
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11
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Published By IEEE
0780389859
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Latest Documents
Most Cited Documents
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Rudimentary finite element thermal modeling of platelet-filled polymer-ceramic composites
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.
◽
10.1109/stherm.2005.1412161
◽
2005
◽
Cited By ~ 3
Author(s):
R.F. Hill
◽
J.L. Strader
Keyword(s):
Finite Element
◽
Thermal Modeling
◽
Ceramic Composites
◽
Filled Polymer
Download Full-text
Advances in liquid coolant technologies for electronics cooling
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.
◽
10.1109/stherm.2005.1412204
◽
2005
◽
Cited By ~ 13
Author(s):
S.C. Mohapatra
◽
D. Loikits
Keyword(s):
Electronics Cooling
◽
Liquid Coolant
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A simple experimental technique for the characterization of the performance of thermoelectric-coolers beyond 100°C
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.
◽
10.1109/stherm.2005.1412172
◽
2005
◽
Cited By ~ 1
Author(s):
A. Nabi
◽
A. Asias
Keyword(s):
Experimental Technique
◽
Thermoelectric Coolers
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On-chip liquid cooling with integrated pump technology
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.
◽
10.1109/stherm.2005.1412203
◽
2005
◽
Cited By ~ 3
Author(s):
H. Oprins
◽
C.C.S. Nicole
◽
J.C. Baret
◽
G. Van der Veken
◽
C. Lasance
◽
...
Keyword(s):
Liquid Cooling
◽
On Chip
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Modeling subthreshold leakage and thermal stability in a production life test environment
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.
◽
10.1109/stherm.2005.1412183
◽
2005
◽
Cited By ~ 1
Author(s):
K. Black
◽
K. Kelly
◽
N. Wright
Keyword(s):
Thermal Stability
◽
Life Test
◽
Test Environment
◽
Subthreshold Leakage
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Analytical modeling of electrokinetic effect on thermal transport in electrolytic flow in microchannels
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.
◽
10.1109/stherm.2005.1412202
◽
2005
◽
Author(s):
Abhishek Jain
◽
M.K. Jensen
Keyword(s):
Thermal Transport
◽
Analytical Modeling
◽
Electrokinetic Effect
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A photo-thermoelectric technique for anisotropic thermal diffusivity characterization of nanowire/nanotube composites
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.
◽
10.1109/stherm.2005.1412193
◽
2005
◽
Cited By ~ 1
Author(s):
T. Borca-Tasciuc
◽
D.-A. Borca-Tasciuc
◽
Gang Chen
Keyword(s):
Thermal Diffusivity
◽
Nanotube Composites
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An analytical temperature prediction method for a chip power map
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.
◽
10.1109/stherm.2005.1412173
◽
2005
◽
Cited By ~ 11
Author(s):
K.K. Sikka
Keyword(s):
Prediction Method
◽
Temperature Prediction
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Smart chip, system and data center enabled by advanced flexible cooling resources
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.
◽
10.1109/stherm.2005.1412162
◽
2005
◽
Cited By ~ 23
Author(s):
C.D. Patel
◽
C.E. Bash
◽
R. Sharma
◽
A. Beitelmal
◽
C.G. Malone
Keyword(s):
Data Center
Download Full-text
Modeling of cylindrical pin-fin heat sinks for electronic packaging
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.
◽
10.1109/stherm.2005.1412168
◽
2005
◽
Cited By ~ 2
Author(s):
W.A. Khan
◽
J.R. Cuham
◽
M.M. Yovanovich
Keyword(s):
Electronic Packaging
◽
Heat Sinks
◽
Pin Fin
Download Full-text
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