On-chip liquid cooling with integrated pump technology

Author(s):  
H. Oprins ◽  
C.C.S. Nicole ◽  
J.C. Baret ◽  
G. Van der Veken ◽  
C. Lasance ◽  
...  
Keyword(s):  
2020 ◽  
Vol 143 (2) ◽  
Author(s):  
Yaser Hadad ◽  
Vahideh Radmard ◽  
Srikanth Rangarajan ◽  
Mahdi Farahikia ◽  
Gamal Refai-Ahmed ◽  
...  

Abstract The industry shift to multicore microprocessor architecture will likely cause higher temperature nonuniformity on chip surfaces, exacerbating the problem of chip reliability and lifespan. While advanced cooling technologies like two phase embedded cooling exist, the technological risks of such solutions make conventional cooling technologies more desirable. One such solution is remote cooling with heatsinks with sequential conduction resistance from chip to module. The objective of this work is to numerically demonstrate a novel concept to remotely cool chips with hotspots and maximize chip temperature uniformity using an optimized flow distribution under constrained geometric parameters for the heatsink. The optimally distributed flow conditions presented here are intended to maximize the heat transfer from a nonuniform chip power map by actively directing flow to a hotspot region. The hotspot-targeted parallel microchannel liquid cooling design is evaluated against a baseline uniform flow conventional liquid cooling design for the industry pressure drop limit of approximately 20 kPa. For an average steady-state heat flux of 145 W/cm2 on core areas (hotspots) and 18 W/cm2 on the remaining chip area (background), the chip temperature uniformity is improved by 10%. Moreover, the heatsink design has improved chip temperature uniformity without a need for any additional system level complexity, which also reduces reliability risks.


2015 ◽  
Vol 22 (4) ◽  
pp. 31-36
Author(s):  
Yonghyun Won ◽  
Sungdong Kim ◽  
Sarah Eunkyung Kim

2007 ◽  
Vol 30 (2) ◽  
pp. 209-217 ◽  
Author(s):  
Herman Oprins ◽  
Geert Van der Veken ◽  
Cline C. S. Nicole ◽  
Clemens J. M. Lasance ◽  
Martine Baelmans
Keyword(s):  

2020 ◽  
Vol 477 (14) ◽  
pp. 2679-2696
Author(s):  
Riddhi Trivedi ◽  
Kalyani Barve

The intestinal microbial flora has risen to be one of the important etiological factors in the development of diseases like colorectal cancer, obesity, diabetes, inflammatory bowel disease, anxiety and Parkinson's. The emergence of the association between bacterial flora and lungs led to the discovery of the gut–lung axis. Dysbiosis of several species of colonic bacteria such as Firmicutes and Bacteroidetes and transfer of these bacteria from gut to lungs via lymphatic and systemic circulation are associated with several respiratory diseases such as lung cancer, asthma, tuberculosis, cystic fibrosis, etc. Current therapies for dysbiosis include use of probiotics, prebiotics and synbiotics to restore the balance between various species of beneficial bacteria. Various approaches like nanotechnology and microencapsulation have been explored to increase the permeability and viability of probiotics in the body. The need of the day is comprehensive study of mechanisms behind dysbiosis, translocation of microbiota from gut to lung through various channels and new technology for evaluating treatment to correct this dysbiosis which in turn can be used to manage various respiratory diseases. Microfluidics and organ on chip model are emerging technologies that can satisfy these needs. This review gives an overview of colonic commensals in lung pathology and novel systems that help in alleviating symptoms of lung diseases. We have also hypothesized new models to help in understanding bacterial pathways involved in the gut–lung axis as well as act as a futuristic approach in finding treatment of respiratory diseases caused by dysbiosis.


2004 ◽  
Author(s):  
K. Semeniuk ◽  
J. Dionne ◽  
A. Makris ◽  
T. Bernard ◽  
C. Ashley ◽  
...  

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