Modeling of cylindrical pin-fin heat sinks for electronic packaging

Author(s):  
W.A. Khan ◽  
J.R. Cuham ◽  
M.M. Yovanovich
Author(s):  
Sulaman Pashah ◽  
Abul Fazal M. Arif

Heat sinks are used in modern electronic packaging system to enhance and sustain system thermal performance by dissipating heat away from IC components. Pin fins are commonly used in heat sink applications. Conventional metallic pins fins are efficient in low Biot number range whereas high thermal performance can be achieved in high Biot number regions with orthotropic composite pin fins due to their adjustable thermal properties. However, several challenges related to performance as well as manufacturing need to be addressed before they can be successfully implemented in a heat sink design. A heat sink assembly with metallic base plate and polymer composite pin fins is a solution to address manufacturing constraints. During the service life of an electronic packaging, the heat sink assembly is subjected to power cycles. Cyclic thermal stresses will be important at the pin-fin and base-plate interface due to thermal mismatch. The cyclic nature of stresses can lead to fatigue failure that will affect the reliability of the heat sink and electronic packaging. A finite element model of the heat sink is used to investigate the thermal stress cyclic effect on thermo-mechanical reliability performance. The aim is to assess the reliability performance of the epoxy bond at the polymer composite pin fins and metallic base plate interface in a heat-sink assembly.


2008 ◽  
Vol 31 (3) ◽  
pp. 536-545 ◽  
Author(s):  
W.A. Khan ◽  
J.R. Culham ◽  
M.M. Yovanovich

Author(s):  
Mehmed Rafet O¨zdemir ◽  
Ali Kos¸ar ◽  
Orc¸un Demir ◽  
Cemre O¨zenel ◽  
Og˘uzhan Bahc¸ivan

Recently, micro/nanofabrication technology has been used to develop a number of microfluidic systems. With its integration to microfluidic devices, microchannels and micro scale pin fin heat sinks find applications in many areas such as drug delivery and propulsion in biochemical reaction chambers and micro mixing. Many research efforts have been performed to reveal thermal and hydrodynamic performances of microchannel based micro fluidic devices. In the current study, it is aimed to extend the knowledge on this field by investigating heat and fluid flow in micro heat sinks at high flow rates. Moreover, thermodynamic and thermo-economic aspects were also considered. De-ionized water was used as the coolant in the system. Flow rates were measured over pressures of 20–80 psi. A serpentine heater was deposited at the back of the micro pin fin devices to enable the delivery of heat to these devices. Two micro-pin fin devices each having different geometrical properties (Circular based and Hydrofoil based) were used in this study. In addition, the performances (thermal-hydraulic, exergy, exergo-economic) were also experimentally obtained for a plain microchannel device. Thermal resistances, exergy efficiencies and thermo-economic parameters were obtained from the devices and their performances were assessed.


Author(s):  
Ali Kosar ◽  
Chih-Jung Kuo ◽  
Yoav Peles

An experimental study on thermal-hydraulic performance of de-ionized water over a bank of shrouded NACA 66-021 hydrofoil micro pin fins with wetted perimeter of 1030-μm and chord thickness of 100 μm has been performed. Average heat transfer coefficients have been obtained over effective heat fluxes ranging from 4.0 to 308 W/cm2 and mass velocities from 134 to 6600 kg/m2s. The experimental data is reduced to the Nusselt numbers, Reynolds numbers, total thermal resistances, and friction factors in order to determine the thermal-hydraulic performance of the heat sink. It has been found that prodigious hydrodynamic improvement can be obtained with the hydrofoil-based micro pin fin heat sink compared to the circular pin fin device. Fluid flow over pin fin heat sinks comprised from hydrofoils yielded radically lower thermal resistances than circular pin fins for a similar pressure drop.


2020 ◽  
Vol 2020 (0) ◽  
pp. 0126
Author(s):  
Koki Nakanishi ◽  
Takashi Fukue ◽  
Keiichi Hamatani ◽  
Hidemi Shirakawa

Author(s):  
D. Sahray ◽  
H. Shmueli ◽  
N. Segal ◽  
G. Ziskind ◽  
R. Letan

In the present work, horizontal-base pin fin heat sinks exposed to free convection in air are studied. They are made of aluminum, and there is no contact resistance between the base and the fins. For the same base dimensions the fin height and pitch vary. The fins have a constant square cross-section. The edges of the sink are blocked: the surrounding insulation is flush with the fin tips. The effect of fin height and pitch on the performance of the sink is studied experimentally and numerically. In the experiments, the heat sinks are heated using foil electrical heaters. The heat input is set, and temperatures of the base and fins are measured. In the corresponding numerical study, the sinks and their environment are modeled using the Fluent 6 software. The results show that heat transfer enhancement due to the fins is not monotonic. The differences between sparsely and densely populated sinks are analyzed for various fin heights. Also assessed are effects of the blocked edges as compared to the previously studied cases where the sink edges were exposed to the surroundings.


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