Rudimentary finite element thermal modeling of platelet-filled polymer-ceramic composites

Author(s):  
R.F. Hill ◽  
J.L. Strader
2014 ◽  
Vol 75 ◽  
pp. 410-418 ◽  
Author(s):  
Robert Mayer ◽  
Elena Enache-Pommer ◽  
Gary Parsons ◽  
Mike Mazor ◽  
Jeff Hansbro ◽  
...  

2015 ◽  
Vol 28 (3) ◽  
pp. 325-344 ◽  
Author(s):  
Roberto Menozzi ◽  
Paolo Cova ◽  
Nicola Delmonte ◽  
Francesco Giuliani ◽  
Giovanna Sozzi

paper reviews the activity carried out at the Department of Information Engineering of the University of Parma, Italy, in the field of thermal and electro-thermal modeling of devices, device and package assemblies, circuits, and systems encompassing active boards and heat-sinking elements. This activity includes: (i) Finite-Element 3D simulation for the thermal analysis of a hierarchy of structures ranging from bare device dies to complex systems including active and passive devices, boards, metallizations, and air- and water-cooled heat-sinks, and (ii) Lumped-Element thermal or electro-thermal models of bare and packaged devices, ranging from purely empirical to strictly physics- and geometry-based.


Author(s):  
Siva P. Gurrum ◽  
Yogendra K. Joshi ◽  
William P. King ◽  
Koneru Ramakrishna

Prediction of the temperature field generated with Joule heating in multilayer interconnect stacks is of critical importance for the design and reliability of future microelectronics. Interconnect failure due to electromigration is strongly dependent on its temperature. Simple models fail to capture thermal interaction between layers and within the layer. Detailed simulations on the other hand, take tremendous time and require large storage. This paper describes a threedimensional compact thermal modeling methodology that captures thermal interactions at a lower computational cost and storage requirements. The method is applicable for arbitrary geometries of interconnects due to the use of the finite element method. Case studies with three interconnects placed on a single level at a pitch of 1.0 μm generating different heat rates are reported. The compact model predicts a temperature rise of 4.11 °C at a current density of 10 MA/cm2 for 6.0 μm long interconnects of 0.18 μm width and an aspect ratio of 2. The error in maximum temperature is about 5% when compared with detailed simulations. The compact model for the current cases consists of 219 nodes whereas the detailed model has 99,000 nodes where temperature is computed.


Author(s):  
N. RAJESH JESUDOSS HYNES ◽  
P. NAGARAJ ◽  
R. MEBY SELVARAJ

Friction welding is a solid state joining process of joining either similar or dissimilar materials. Joining of ceramic/metal joints by friction welding has opened up new possibilities in many engineering applications. In the present work, thermal modeling of friction welding process has been carried out. Using Finite Element Approach (FEA), analytical solutions were arrived for different ceramic/metal combinations. The temperature distributions of cylindrical surfaces of the alumina and the metals are found by means of 1D heat transfer assumption considering the effect of convection. In the thermal analysis, interfacial temperature and thermal conductivity of the material play a significant role. Based on the obtained temperature distribution the graphs are plotted between the length of the joint and the temperatures. Thus the knowledge of the temperature joint distribution could be helpful in predicting the thermal cycle of the process, microstructure evolution and residual stress formation. Thus the obtained graph helps to study and predict the temperature distribution of both the materials.


2010 ◽  
Vol 20 (3) ◽  
pp. 1785-1789 ◽  
Author(s):  
Yunxing Song ◽  
Tao Peng ◽  
Liang Li ◽  
Yiliang Lv ◽  
Li Qiu

2015 ◽  
Vol 782 ◽  
pp. 278-290 ◽  
Author(s):  
Qing Xiang Wang ◽  
Hong Mei Zhang ◽  
Hong Nian Cai ◽  
Qun Bo Fan

Co-continuous ceramic composites have a complicated topology structure which makes it much more difficult for finite element model reconstruction. In this paper, the two-dimensional co-continuous ceramic composites finite element model is reconstructed by a modified quartet structure generation set method which modified the generation parameters based on quartet structure generation set (QSGS) method, and a numerical simulation at high strain rate is accomplished. The content mainly contains: (1) The distribution features of metal phase and ceramic phase of real co-continuous ceramic composites SEM image is calculated by mathematical statistics to determine the parameters that control the reconstruction such as volume fraction, core distribution probability and directional growth probability; (2) Two phase volume fraction and 2-point correlation function of the reconstructed finite element model is calculated as the quality assessment parameters, which verify the reconstructed finite element model are in allowable error range compared with the real SEM image; (3) Numerical simulation at high strain rate is carried out using the reconstructed finite element model. The failure behavior of co-continuous ceramic composites at high strain rate is analyzed, validates the reconstructed finite element model meets the requirements of numerical calculation.


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