1991 Proceedings 41st Electronic Components & Technology Conference
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144

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14

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Published By IEEE

0780300122

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Overmolded plastic pad array carriers (OMPAC): a low cost, high interconnect density IC packaging solution for consumer and industrial electronics

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163873 ◽

2002 ◽

Author(s):

B. Freyman ◽

R. Pennisi

Keyword(s):

Low Cost ◽

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Flip-chip interconnection technology for advanced thermal conduction modules

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163967 ◽

2002 ◽

Author(s):

S.K. Ray ◽

K. Beckham ◽

R. Master

Keyword(s):

Thermal Conduction ◽

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Use of guided wave optics for board level and mainframe level interconnects

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163917 ◽

2002 ◽

Author(s):

D.H. Hartman

Keyword(s):

Guided Wave ◽

Wave Optics ◽

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A thin films on MLC application

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163844 ◽

2002 ◽

Author(s):

G.B. Leung ◽

S.A. Sands

Keyword(s):

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High frequency performance of capacitors

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163898 ◽

2002 ◽

Author(s):

A.T. Murphy ◽

F.J. Young

Keyword(s):

High Frequency ◽

High Frequency Performance

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Modeling of self-alignment mechanism in flip-chip soldering. II. Multichip solder joints

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163969 ◽

2002 ◽

Author(s):

S.K. Patra ◽

Y.C. Lee

Keyword(s):

Flip Chip ◽

Solder Joints ◽

Alignment Mechanism

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Microelectronics packaging processing using focused high power electron beams

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163946 ◽

2002 ◽

Author(s):

Y.-W. Yau ◽

M.A. Booke ◽

N.S. Sandhu ◽

J.J. Fulton

Keyword(s):

Electron Beams ◽

Microelectronics Packaging

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Use of highly accelerated life test (HALT) to determine reliability of multilayer ceramic capacitors

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163895 ◽

2002 ◽

Author(s):

R. Confer ◽

J. Canner ◽

T. Trostle ◽

S. Kurtz

Keyword(s):

Accelerated Life Test ◽

Life Test ◽

Multilayer Ceramic Capacitors ◽

Accelerated Life ◽

Ceramic Capacitors ◽

Multilayer Ceramic

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Microwave dielectric constant of a low temperature co-fired ceramic

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163846 ◽

2002 ◽

Author(s):

J.W. Gipprich ◽

K.A. Leahy ◽

A.J. Martin ◽

E.L. Rich ◽

K.W. Sparks

Keyword(s):

Dielectric Constant ◽

Low Temperature ◽

Microwave Dielectric

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Nonlinear dynamic response of a flexible printed circuit board to a shock load applied to its support contour

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163905 ◽

2002 ◽

Author(s):

E. Suhir

Keyword(s):

Dynamic Response ◽

Nonlinear Dynamic ◽

Printed Circuit Board ◽

Circuit Board ◽

Nonlinear Dynamic Response ◽

Printed Circuit ◽

Flexible Printed Circuit

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