1991 Proceedings 41st Electronic Components & Technology Conference
Latest Publications

TOTAL DOCUMENTS

144

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780300122

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

High frequency performance of capacitors

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163898 ◽

2002 ◽

Cited By ~ 7

Author(s):

A.T. Murphy ◽

F.J. Young

Keyword(s):

High Frequency ◽

High Frequency Performance

Flip-chip interconnection technology for advanced thermal conduction modules

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163967 ◽

2002 ◽

Cited By ~ 12

Author(s):

S.K. Ray ◽

K. Beckham ◽

R. Master

Keyword(s):

Thermal Conduction ◽

Flip Chip

Use of guided wave optics for board level and mainframe level interconnects

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163917 ◽

2002 ◽

Cited By ~ 5

Author(s):

D.H. Hartman

Keyword(s):

Guided Wave ◽

Wave Optics ◽

Board Level

A thin films on MLC application

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163844 ◽

2002 ◽

Cited By ~ 6

Author(s):

G.B. Leung ◽

S.A. Sands

Keyword(s):

Thin Films

Overmolded plastic pad array carriers (OMPAC): a low cost, high interconnect density IC packaging solution for consumer and industrial electronics

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163873 ◽

2002 ◽

Cited By ~ 16

Author(s):

B. Freyman ◽

R. Pennisi

Keyword(s):

Low Cost ◽

Ic Packaging

Use of highly accelerated life test (HALT) to determine reliability of multilayer ceramic capacitors

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163895 ◽

2002 ◽

Cited By ~ 4

Author(s):

R. Confer ◽

J. Canner ◽

T. Trostle ◽

S. Kurtz

Keyword(s):

Accelerated Life Test ◽

Life Test ◽

Multilayer Ceramic Capacitors ◽

Accelerated Life ◽

Ceramic Capacitors ◽

Multilayer Ceramic

Microwave dielectric constant of a low temperature co-fired ceramic

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163846 ◽

2002 ◽

Cited By ~ 2

Author(s):

J.W. Gipprich ◽

K.A. Leahy ◽

A.J. Martin ◽

E.L. Rich ◽

K.W. Sparks

Keyword(s):

Dielectric Constant ◽

Low Temperature ◽

Microwave Dielectric

Nonlinear dynamic response of a flexible printed circuit board to a shock load applied to its support contour

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163905 ◽

2002 ◽

Cited By ~ 5

Author(s):

E. Suhir

Keyword(s):

Dynamic Response ◽

Nonlinear Dynamic ◽

Printed Circuit Board ◽

Circuit Board ◽

Shock Load ◽

Nonlinear Dynamic Response ◽

Printed Circuit ◽

Flexible Printed Circuit

Electrical design technology for low dielectric constant multilayer ceramic substrate

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163959 ◽

2002 ◽

Author(s):

A. Sasaki ◽

Y. Shimada

Keyword(s):

Dielectric Constant ◽

Ceramic Substrate ◽

Low Dielectric Constant ◽

Design Technology ◽

Low Dielectric ◽

Multilayer Ceramic

Brittle cracks induced in AlSi wire by the ultrasonic bonding tool

1991 Proceedings 41st Electronic Components & Technology Conference ◽

10.1109/ectc.1991.163979 ◽

2002 ◽

Cited By ~ 4

Author(s):

R.T. Fitzsimmons ◽

C.E. Miller

Keyword(s):

Ultrasonic Bonding

1991 Proceedings 41st Electronic Components & Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

High frequency performance of capacitors

Flip-chip interconnection technology for advanced thermal conduction modules

Use of guided wave optics for board level and mainframe level interconnects

A thin films on MLC application

Overmolded plastic pad array carriers (OMPAC): a low cost, high interconnect density IC packaging solution for consumer and industrial electronics

Use of highly accelerated life test (HALT) to determine reliability of multilayer ceramic capacitors

Microwave dielectric constant of a low temperature co-fired ceramic

Nonlinear dynamic response of a flexible printed circuit board to a shock load applied to its support contour

Electrical design technology for low dielectric constant multilayer ceramic substrate

Brittle cracks induced in AlSi wire by the ultrasonic bonding tool

1991 Proceedings 41st Electronic Components & Technology Conference
Latest Publications