Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291)

Vacuum encapsulation of resonant devices using permeable polysilicon

Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291) ◽

10.1109/memsys.1999.746874 ◽

1999 ◽

Cited By ~ 44

Author(s):

K.S. Lebouitz ◽

A. Mazaheri ◽

R.T. Howe ◽

A.P. Pisano

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Highly sensitive optical coherent detection system using surface micromachining technology

Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291) ◽

10.1109/memsys.1999.746853 ◽

1999 ◽

Author(s):

C. Pu ◽

Z. Zhu ◽

Y.-H. Lo

Keyword(s):

Detection System ◽

Coherent Detection ◽

Surface Micromachining ◽

Highly Sensitive

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Development of bi-directional valve-less micropump for liquid

Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291) ◽

10.1109/memsys.1999.746791 ◽

1999 ◽

Cited By ~ 15

Author(s):

S. Matsumoto ◽

A. Klein ◽

R. Maeda

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Micro IC probe for LSI testing

Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291) ◽

10.1109/memsys.1999.746830 ◽

1999 ◽

Cited By ~ 9

Author(s):

T. Ito ◽

R. Sawada ◽

E. Higurashi

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A high-performance silicon micropump for an implantable drug delivery system

Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291) ◽

10.1109/memsys.1999.746886 ◽

1999 ◽

Cited By ~ 42

Author(s):

D. Maillefer ◽

H. van Lintel ◽

G. Rey-Mermet ◽

R. Hirschi

Keyword(s):

Drug Delivery ◽

Drug Delivery System ◽

Delivery System ◽

High Performance

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An active catheter with integrated circuit for communication and control

Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291) ◽

10.1109/memsys.1999.746862 ◽

1999 ◽

Cited By ~ 11

Author(s):

K.-T. Park ◽

M. Esashi

Keyword(s):

Integrated Circuit ◽

And Control

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Automated optimal synthesis of microaccelerometers

Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291) ◽

10.1109/memsys.1999.746848 ◽

1999 ◽

Cited By ~ 13

Author(s):

T. Mukherjee ◽

Y. Zhou ◽

G.K. Fedder

Keyword(s):

Optimal Synthesis

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Two-dimensional micro conveyer with integrated electrostatic actuators

Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291) ◽

10.1109/memsys.1999.746749 ◽

1999 ◽

Cited By ~ 9

Author(s):

M. Edo ◽

Y. Watanabe ◽

O. Morita ◽

H. Nakazawa ◽

E. Yonezawa

Keyword(s):

Two Dimensional ◽

Electrostatic Actuators

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Low pressure and low temperature hermetic wafer bonding using microwave heating

Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291) ◽

10.1109/memsys.1999.746877 ◽

1999 ◽

Cited By ~ 19

Author(s):

N.K. Budraa ◽

H.W. Jackson ◽

M. Barmatz ◽

W.T. Pike ◽

J.D. Mai

Keyword(s):

Low Temperature ◽

Microwave Heating ◽

Wafer Bonding ◽

Low Pressure

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Silicon as tool material for polymer hot embossing

Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291) ◽

10.1109/memsys.1999.746819 ◽

1999 ◽

Cited By ~ 31

Author(s):

H. Becker ◽

U. Heim

Keyword(s):

Tool Material ◽

Hot Embossing

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Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Vacuum encapsulation of resonant devices using permeable polysilicon

Highly sensitive optical coherent detection system using surface micromachining technology

Development of bi-directional valve-less micropump for liquid

Micro IC probe for LSI testing

A high-performance silicon micropump for an implantable drug delivery system

An active catheter with integrated circuit for communication and control

Automated optimal synthesis of microaccelerometers

Two-dimensional micro conveyer with integrated electrostatic actuators

Low pressure and low temperature hermetic wafer bonding using microwave heating

Silicon as tool material for polymer hot embossing

Export Citation Format

Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Vacuum encapsulation of resonant devices using permeable polysilicon

Highly sensitive optical coherent detection system using surface micromachining technology

Development of bi-directional valve-less micropump for liquid

Micro IC probe for LSI testing

A high-performance silicon micropump for an implantable drug delivery system

An active catheter with integrated circuit for communication and control

Automated optimal synthesis of microaccelerometers

Two-dimensional micro conveyer with integrated electrostatic actuators

Low pressure and low temperature hermetic wafer bonding using microwave heating

Silicon as tool material for polymer hot embossing

Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291)
Latest Publications