Deterioration Behavior of Epoxy Resin for Electronics Packaging and Its Adhesive Joint with Ni by Water Absorption
2018 ◽
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2018 ◽
Vol 251
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pp. 01034
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2017 ◽
Vol 24
(5)
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pp. 731-738
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2015 ◽
Vol 3
(27)
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pp. 7195-7202
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