Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium
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Development of Junction Temperature Decision (JTD) Map for Thermal Design of Nano-scale Devices Considering Leakage Power

Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2007.352407 ◽

2007 ◽

Author(s):

Yunhyeok Im ◽

Eun Seok Cho ◽

Kiwon Choi ◽

Sayoon Kang

Keyword(s):

Leakage Power ◽

Thermal Design ◽

Junction Temperature ◽

Nano Scale

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Extraction of Power Dissipation Profile in an IC Chip from Temperature Map

Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2007.352405 ◽

2007 ◽

Cited By ~ 5

Author(s):

Xi Wang ◽

Ali Shakouri ◽

Sina Farsiu ◽

Peyman Milanfar

Keyword(s):

Power Dissipation

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A Statistical Approach For Characterizing The Thermal Impact Of TIM Voids

Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2007.352390 ◽

2007 ◽

Cited By ~ 2

Author(s):

Sai Ankireddi ◽

David Copeland

Keyword(s):

Statistical Approach ◽

Thermal Impact

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Junction Temperature During Burn-in: How Variable is It and How Can We Control It?

Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2007.352418 ◽

2007 ◽

Cited By ~ 2

Author(s):

James Forster ◽

Chris Lopez

Keyword(s):

Junction Temperature

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Thermal Management of High Density Very Low Profile Memory Module

Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2007.352410 ◽

2007 ◽

Cited By ~ 1

Author(s):

Hongyu Ran ◽

Ilyas Mohammed

Keyword(s):

Thermal Management ◽

High Density ◽

Memory Module ◽

Low Profile

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Non-Contact Surface Temperature Measurements Coupled with Ultrafast Real-Time Computation

Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2007.352406 ◽

2007 ◽

Cited By ~ 2

Author(s):

Peter E. Raad ◽

Pavel L. Komarov ◽

Mihai G. Burzo

Keyword(s):

Surface Temperature ◽

Real Time ◽

Contact Surface ◽

Temperature Measurements

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Process Development for Heat Sink Attachment Using Thermally Conductive Liquid Adhesives

Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2007.352396 ◽

2007 ◽

Author(s):

Sang-jeon Cho ◽

Emily Allen ◽

Don Nguyen ◽

Quyen Chu

Keyword(s):

Heat Sink ◽

Process Development ◽

Conductive Liquid ◽

Thermally Conductive

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A Novel Carbon Nano Tube based Wick Structure for Heat Pipes/Vapor Chambers

Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2007.352394 ◽

2007 ◽

Cited By ~ 6

Author(s):

Unni Vadakkan ◽

Gregory M. Chrysler ◽

James Maveety ◽

Murli Tirumala

Keyword(s):

Heat Pipes ◽

Wick Structure ◽

Carbon Nano Tube

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Spray Cooling with Mixtures of Dielectric Fluids

Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2007.352414 ◽

2007 ◽

Cited By ~ 3

Author(s):

Andrea C. Ashwood ◽

Timothy A. Shedd

Keyword(s):

Spray Cooling ◽

Dielectric Fluids

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Modeling Air-Cooled Heat Sinks as Heat Exchangers

Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2007.352424 ◽

2007 ◽

Cited By ~ 12

Author(s):

Robert J. Moffat

Keyword(s):

Heat Exchangers ◽

Heat Sinks

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Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management SymposiumLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Development of Junction Temperature Decision (JTD) Map for Thermal Design of Nano-scale Devices Considering Leakage Power

Extraction of Power Dissipation Profile in an IC Chip from Temperature Map

A Statistical Approach For Characterizing The Thermal Impact Of TIM Voids

Junction Temperature During Burn-in: How Variable is It and How Can We Control It?

Thermal Management of High Density Very Low Profile Memory Module

Non-Contact Surface Temperature Measurements Coupled with Ultrafast Real-Time Computation

Process Development for Heat Sink Attachment Using Thermally Conductive Liquid Adhesives

A Novel Carbon Nano Tube based Wick Structure for Heat Pipes/Vapor Chambers

Spray Cooling with Mixtures of Dielectric Fluids

Modeling Air-Cooled Heat Sinks as Heat Exchangers

Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Latest Publications