Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204)

Development of 3-dimensional memory module using anisotropic conductive adhesive films

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) ◽

10.1109/iemte.1998.723054 ◽

2002 ◽

Cited By ~ 3

Author(s):

T. Kikkawa ◽

R. Ideda ◽

T. Matsuda ◽

T. Watanabe

Keyword(s):

Conductive Adhesive ◽

Memory Module ◽

3 Dimensional ◽

Anisotropic Conductive Adhesive

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Practical production uses of SMT adhesives

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) ◽

10.1109/iemte.1998.723077 ◽

2002 ◽

Cited By ~ 6

Author(s):

S.R. Marongelli ◽

D. Dixon ◽

S. Porcari ◽

W. Cummings ◽

F. Murch ◽

...

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Solder ball bumper SB/sup 2/-a flexible manufacturing tool for 3-dimensional sensor and microsystem packages

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) ◽

10.1109/iemte.1998.723062 ◽

2002 ◽

Cited By ~ 2

Author(s):

P. Kasulke ◽

W. Schmidt ◽

L. Titerle ◽

H. Bohnaker ◽

T. Oppert ◽

...

Keyword(s):

Flexible Manufacturing ◽

Solder Ball ◽

3 Dimensional

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Low-cost direct chip attach: comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) ◽

10.1109/iemte.1998.723059 ◽

2002 ◽

Author(s):

U. Behner ◽

C.-P. Czaya ◽

R. Haug ◽

F.-D. Hauschild ◽

H. Jiang ◽

...

Keyword(s):

Low Cost ◽

Conductive Adhesive

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Charge build-up and its reduction in plasma cleaning process

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) ◽

10.1109/iemte.1998.723065 ◽

2002 ◽

Cited By ~ 5

Author(s):

K. Arita ◽

K. Noda ◽

T. Asano

Keyword(s):

Plasma Cleaning ◽

Cleaning Process

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MID in the automotive industry-potentials, benefits and applications

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) ◽

10.1109/iemte.1998.723063 ◽

2002 ◽

Cited By ~ 6

Author(s):

K. Feldmann ◽

F. Pohlau

Keyword(s):

Automotive Industry

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Prospective developments in automotive instrumentation

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) ◽

10.1109/iemte.1998.723050 ◽

2002 ◽

Cited By ~ 3

Author(s):

A. Slack

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Thermal expansion and thermal conductivity of continuous carbon fibre reinforced copper matrix composites

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) ◽

10.1109/iemte.1998.723067 ◽

2002 ◽

Cited By ~ 3

Author(s):

J. Korab ◽

G. Korb ◽

P. Sebo

Keyword(s):

Thermal Conductivity ◽

Thermal Expansion ◽

Carbon Fibre ◽

Copper Matrix ◽

Matrix Composites ◽

Copper Matrix Composites

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New methods in accelerated reliability testing of electronic components for automotives under field conditions

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) ◽

10.1109/iemte.1998.723076 ◽

2002 ◽

Cited By ~ 1

Author(s):

H. Berek ◽

V. Tiederle ◽

T. Fritzsch

Keyword(s):

Field Conditions ◽

Reliability Testing ◽

Electronic Components ◽

New Methods

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Development tendencies in automotive electronics

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) ◽

10.1109/iemte.1998.723049 ◽

2002 ◽

Author(s):

W. Runge

Keyword(s):

Automotive Electronics

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Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Development of 3-dimensional memory module using anisotropic conductive adhesive films

Practical production uses of SMT adhesives

Solder ball bumper SB/sup 2/-a flexible manufacturing tool for 3-dimensional sensor and microsystem packages

Low-cost direct chip attach: comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding

Charge build-up and its reduction in plasma cleaning process

MID in the automotive industry-potentials, benefits and applications

Prospective developments in automotive instrumentation

Thermal expansion and thermal conductivity of continuous carbon fibre reinforced copper matrix composites

New methods in accelerated reliability testing of electronic components for automotives under field conditions

Development tendencies in automotive electronics

Export Citation Format

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Development of 3-dimensional memory module using anisotropic conductive adhesive films

Practical production uses of SMT adhesives

Solder ball bumper SB/sup 2/-a flexible manufacturing tool for 3-dimensional sensor and microsystem packages

Low-cost direct chip attach: comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding

Charge build-up and its reduction in plasma cleaning process

MID in the automotive industry-potentials, benefits and applications

Prospective developments in automotive instrumentation

Thermal expansion and thermal conductivity of continuous carbon fibre reinforced copper matrix composites

New methods in accelerated reliability testing of electronic components for automotives under field conditions

Development tendencies in automotive electronics

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204)
Latest Publications