2007 IEEE International Interconnect Technology Conferencee
Latest Publications

TOTAL DOCUMENTS

71

(FIVE YEARS 0)

H-INDEX

11

(FIVE YEARS 0)

Published By IEEE

142441069x

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Robust integration of an ULK SiOCH dielectric (k=2.3) for high performance 32nm node BEOL

2007 IEEE International Interconnect Technology Conferencee ◽

10.1109/iitc.2007.382382 ◽

2007 ◽

Author(s):

M. Aimadeddine ◽

P. Maury ◽

V. Delaye ◽

N. Jourdan ◽

T. Vanypre ◽

...

Keyword(s):

High Performance ◽

Robust Integration

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IEEE 2007 International Interconnect Technology Conference

2007 IEEE International Interconnect Technology Conferencee ◽

10.1109/iitc.2007.382323 ◽

2007 ◽

Keyword(s):

Interconnect Technology

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Three dimensional chip stacking using a wafer-to-wafer integration

2007 IEEE International Interconnect Technology Conferencee ◽

10.1109/iitc.2007.382355 ◽

2007 ◽

Author(s):

Ritwik Chatterjee ◽

Marc Zussy ◽

Antonio Roman ◽

Olivier Louveau ◽

Sylvain Maitrejean ◽

...

Keyword(s):

Three Dimensional

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A comparative study of thermal and plasma enhanced ALD Ta-N-C films on SiO2, SiCOH and Cu substrates

2007 IEEE International Interconnect Technology Conferencee ◽

10.1109/iitc.2007.382335 ◽

2007 ◽

Author(s):

H. Wojcik ◽

M. Friedemann ◽

F. Feustel ◽

M. Albert ◽

S. Ohsiek ◽

...

Keyword(s):

Comparative Study ◽

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Challenges for 3D IC integration: bonding quality and thermal management

2007 IEEE International Interconnect Technology Conferencee ◽

10.1109/iitc.2007.382392 ◽

2007 ◽

Author(s):

Patrick Leduc ◽

Nicolas Sillon ◽

Sylvain Maitrejean ◽

Didier Louis ◽

Gerard Passemard ◽

...

Keyword(s):

Thermal Management ◽

3D Ic ◽

Bonding Quality

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The critical role of the metal / porous low-k interface in post direct CMP defectivity generation and resulting ULK surface and bulk hydrophilisation

2007 IEEE International Interconnect Technology Conferencee ◽

10.1109/iitc.2007.382379 ◽

2007 ◽

Author(s):

Y. Travaly ◽

F. Sinapi ◽

N. Heylen ◽

A. Humbert ◽

M. Delande ◽

...

Keyword(s):

Critical Role ◽

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An alternative low resistance MOL technology with electroplated rhodium as contact plugs for 32nm CMOS and beyond

2007 IEEE International Interconnect Technology Conferencee ◽

10.1109/iitc.2007.382360 ◽

2007 ◽

Author(s):

I. Shao ◽

J.M. Cotte ◽

B. Haran ◽

A.W. Topol ◽

E.E. Simonyi ◽

...

Keyword(s):

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Stress and Slurry Chemistry Effects on CMP Damage of Ultra-Low-k Dielectrics

2007 IEEE International Interconnect Technology Conferencee ◽

10.1109/iitc.2007.382373 ◽

2007 ◽

Author(s):

Taek-Soo Kim ◽

Qiping Zhong ◽

Maria Peterson ◽

Halbert Tam ◽

Tomohisa Konno ◽

...

Keyword(s):

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Electrical Properties of Carbon Nanotube Via Interconnects Fabricated by Novel Damascene Process

2007 IEEE International Interconnect Technology Conferencee ◽

10.1109/iitc.2007.382390 ◽

2007 ◽

Author(s):

Mizuhisa Nihei ◽

Takashi Hyakushima ◽

Shintaro Sato ◽

Tatsuhiro Nozue ◽

Masaaki Norimatsu ◽

...

Keyword(s):

Carbon Nanotube ◽

Electrical Properties ◽

Damascene Process

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Impact of TaN/Ta copper barrier on full PEALD TiN/Ta2O5/TiN 3D damascene MIM capacitor performance

2007 IEEE International Interconnect Technology Conferencee ◽

10.1109/iitc.2007.382377 ◽

2007 ◽

Author(s):

M. Thomas ◽

A. Farcy ◽

E. Deloffre ◽

M. Gros-Jean ◽

C. Perrot ◽

...

Keyword(s):

Capacitor Performance

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