2012 IEEE International Interconnect Technology Conference
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78
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9781467311373, 9781467311380, 9781467311366
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Novel Cu reflow seed process for Cu/low-k 64nm pitch dual damascene interconnects and beyond

2012 ◽  
Author(s):  
K. Motoyama ◽  
O. van der Straten ◽  
H. Tomizawa ◽  
J. Maniscalco ◽  
S.T. Chen
Keyword(s):  
Dual Damascene ◽  
Damascene Interconnects ◽  
Low K

Electrical and structural characterization of 150 nm CNT contacts with Cu damascene top metallization

2012 ◽  
Author(s):  
Marleen H. van der Veen ◽  
Bart Vereecke ◽  
Masahito Sugiura ◽  
Yusaku Kashiwagi ◽  
Xiaoxing Ke ◽  
...  
Keyword(s):  
Structural Characterization

Annealing process and structural considerations in controlling extrusion-type defects Cu TSV

2012 ◽  
Author(s):  
Jinho An ◽  
Kwang-Jin Moon ◽  
Soyoung Lee ◽  
Do-Sun Lee ◽  
Kiyoung Yun ◽  
...  
Keyword(s):  
Annealing Process

Novel flowable CVD process technology for sub-20nm interlayer dielectrics

2012 ◽  
Author(s):  
Honggun Kim ◽  
Seungheon Lee ◽  
Jun-Won Lee ◽  
ByeongJu Bae ◽  
YongSoon Choi ◽  
...  
Keyword(s):  
Process Technology ◽  
Interlayer Dielectrics

In-situ metal/dielectric capping process for electromigration enhancement in Cu interconnects

2012 ◽  
Author(s):  
C.-C. Yang ◽  
F. Chen ◽  
B. Li ◽  
H. Shobha ◽  
S. Nguyen ◽  
...  
Keyword(s):  
Cu Interconnects

Growth characteristics of Mn silicate barrier layers on SiO2

2012 ◽  
Author(s):  
P. Casey ◽  
J. Bogan ◽  
A.P. McCoy ◽  
J.G. Lozano ◽  
P.D. Nellist ◽  
...  
Keyword(s):  
Growth Characteristics ◽  
Barrier Layers

Multi-layer graphene wire grown by annealing sputtered amorphous carbon

2012 ◽  
Author(s):  
Motonobu Sato ◽  
Makoto Takahashi ◽  
Haruhisa Nakano ◽  
Tomo Murakami ◽  
Akio Kawabata ◽  
...  
Keyword(s):  
Amorphous Carbon ◽  
Layer Graphene
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