2017 IEEE International Interconnect Technology Conference (IITC)
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TOTAL DOCUMENTS

51
(FIVE YEARS 0)

H-INDEX

7
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Published By IEEE

9781509064748
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Spin waves for interconnect applications

2017 ◽  
Author(s):  
F. Ciubotaru ◽  
O. Zografos ◽  
G. Talmelli ◽  
C. Adelmann ◽  
I. P. Radu ◽  
...  
Keyword(s):  
Spin Waves

A novel role for SiCN to suppress H2O outgas from TEOS oxide films in hybrid bonding

2017 ◽  
Author(s):  
T. Ueda ◽  
M. Tetani ◽  
Y. Morinaga ◽  
M. Hamada ◽  
M. Takeuchi ◽  
...  
Keyword(s):  
Oxide Films

Tungsten corrosion and recess improvement by feasible slurry and clean chemical in WCMP process

2017 ◽  
Author(s):  
Kuang-Wei Chen ◽  
Chun-Fu Chen ◽  
Yung-Tai Hung ◽  
Tuung Luoh ◽  
Ling-Wuu Yang ◽  
...  

N5 technology node dual-damascene interconnects enabled using multi patterning

2017 ◽  
Author(s):  
B. Briggs ◽  
C. J. Wilson ◽  
K. Devriendt ◽  
M. H. van der Veen ◽  
S. Decoster ◽  
...  
Keyword(s):  
Technology Node ◽  
Dual Damascene ◽  
Damascene Interconnects

Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metal

2017 ◽  
Author(s):  
S-A. Chew ◽  
H. Yu ◽  
M. Schaekers ◽  
S. Demuynck ◽  
G. Mannaert ◽  
...  
Keyword(s):  
Contact Metal

Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process

2017 ◽  
Author(s):  
Shibesh Dutta ◽  
Shreya Kundu ◽  
Lianggong Wen ◽  
Geraldine Jamieson ◽  
Kristof Croes ◽  
...  
Keyword(s):  
Cross Section ◽  
Cross Section Area ◽  
Section Area

Transistors on two-dimensional semiconductors: contact resistance limited by the contact edges

2017 ◽  
Author(s):  
G. Arutchelvan ◽  
P. Matagne ◽  
C. Lockhart de la Rosa ◽  
S. Sutar ◽  
S. De Gendt ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Two Dimensional
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