Effect of wetting agent on the properties of thermal grease with Al based fillers

Author(s):  
Ling Zhang ◽  
Zhi Zhang ◽  
Pengli Zhu ◽  
Kai Zhang ◽  
Xianzhu Fu ◽  
...  
Keyword(s):  
Author(s):  
HaNeul Kang ◽  
HyunJi Kim ◽  
SangHyoek Park ◽  
JinHo Yang ◽  
Sunchul Huh

1996 ◽  
Vol 36 (3) ◽  
pp. 373 ◽  
Author(s):  
KA Seaton ◽  
DC Joyce

In postharvest dipping treatment of Geraldton waxflower (Chamelaucium uncinatum), 13 insecticides tested at recommended application rates caused no visual injury, but some reduced vase life. Flowers of cv. Purple Pride were more sensitive to insecticides than leaves. There was no loss of vase life of flowers following dipping in chlorpyrifos, dimethoate or permethrin. Following dipping in deltamethrin, carbaryl, dichlorvos, cypermethrin, endosulfan or fenvalerate there was 31-49% loss of vase life. No loss of vase life was observed for cv. Alba, after dipping in carbaryl, fenvalerate or dimethoate. Insecticide dips containing wetting agent and a fungicide (e.g. a combination of deltamenthrin, Aqua and benomyl) was a suitable dip for Geraldton waxflower. Wetting agents varied in their effect on vase life. Aqua shortened vase life less than Agral, and D-CTrate less than D-C-Tron. Stems rapidly lost weight when held out of water following dipping, and vase life was reduced when ambient temperatures were above 30�C or drying times exceeded 60 min. It was concluded that flowers should be kept cool and well hydrated following dipping treatment.


2009 ◽  
Vol 24 (1) ◽  
pp. 43-49 ◽  
Author(s):  
Slavica Vukovic ◽  
Dusanka Indjic ◽  
Vojislava Bursic ◽  
Dragana Sunjka ◽  
Mila Grahovac

Simultaneous occurrence of different harmful species in agricultural practice necessitates that different plant protection chemicals be applied at the same time (tank mix). Mix components differ in purpose, mode of action and/or formulation, while addition of no pesticide components (complex fertilizers, adjuvant and wetting agents) is widely practiced today. However, data concerning the effects of water quality used for preparation of working liquids on the biological effects of pesticides is still scarce. Therefore, the objective of this study was to determine insecticidal effects as depending on components used in mixes and water hardness. The effects of mixtures of thiametoxam (Actara 25-WG 0,07kg/ha) with azoxystrobin (Quadris 0.75 l/ha), mancozeb (Dithane M-70 2.5 kg/ha), a complex fertilizer (Mortonijc plus 3 kg/ha) and a wetting agent (Silwet L-77), depending on the components and water hardness (slightly hard (15.4 d?) - tap water from Novi Sad, and very hard (34.7 d?) - well water from Adica, a Novi Sad suburb), were determined in a bioassay based on adult mortality rate of the first generation of Colorado potato beetle (Leptinotarsa decemlineata Say). The mixtures were applied by a flooding method. The trial was set up to include four replications. Insecticidal effects were determined 24 h and 48 h after exposure. Thiametoxam effectiveness 24 h and 48 h after application in slightly hard water was 100% when the insecticide was applied alone and in double and triple mixes with the fungicides, complex fertilizer and wetting agent, showing no dependency on mix components. The tested adult population of Colorado potato beetle demonstrated high susceptibility to thiametoxam, while the other components had no impact in slightly hard water. In very hard water, 24 h after application, the insecticidal effect had the same level of significance to thiametoxam in double and triple mixes, with an exception of thiametoxam+mancozeb+Mortonijc plus and thiametoxam+mancozeb+wetting agent combinations, which showed significantly lower efficacy. After 48 h, substantially lower effectiveness, in comparison with the sole insecticide and other combinations, was only observed in thiametoksam+mancozeb+Mortonjic plus combination. Significantly lower efficacy of that combination is probably due to an incompatibility of the macozeb preparation and the complex fertilizer containing boron (B), which was evidenced only in very hard water.


2011 ◽  
Vol 27 (4) ◽  
pp. 423-432 ◽  
Author(s):  
Andrea Weeks ◽  
Doerte Luensmann ◽  
Adrienne Boone ◽  
Lyndon Jones ◽  
Heather Sheardown

2000 ◽  
Author(s):  
Ravi S. Prasher ◽  
Craig Simmons ◽  
Gary Solbrekken

Abstract Thermal interface material (TIM) between the die and the heat spreader or between the heat spreader and the heat sink in any electronic package plays a very important role in the thermal management of electronic cooling. Due to increased power and power density high-performance TIMs are sought every day. Phase change materials (PCM) seem to be very good alternative to traditionally used thermal greases because of various reasons. These phase change materials also have the advantage of being reworked easily without damaging the die. Typically these phase change materials are polymer based and are particle laden to enhance their thermal conductivity. The thermal conductivity of these materials is relatively well understood than their contact resistance. Current work focuses on explicitly measuring the contact resistance and the thermal conductivity of a particular phase change TIM and some silicon-based greases. Effect of various parameters, which can affect the contact resistance of theses TIMs and Greases, are also captured. The steady state measurements of the thermal conductivity and the contact resistance was done on an interface tester. In general the work on the contact resistance of fluid-like polymer based TIM, such as thermal grease or phase change polymer has been experimental in the past. A semi-analytical model, which captures the various parameters affecting the contact resistance of two class of materials; the phase change and the thermal grease is also developed in this paper. This model fits very well with the experimental data.


1999 ◽  
Vol 2 (3) ◽  
pp. 867-868
Author(s):  
A. Tanveer . ◽  
M. Ayub . ◽  
R. Ahmad . ◽  
A. Ali .
Keyword(s):  

2019 ◽  
Vol 2019 (1) ◽  
pp. 000312-000315
Author(s):  
Maciej Patelka ◽  
Sho Ikeda ◽  
Koji Sasaki ◽  
Hiroki Myodo ◽  
Nortisuka Mizumura

Abstract High power semiconductor applications require a Thermal Interface Die Attach Material with high thermal conductivity to efficiently release the heat generated from these devices. Current Thermal Interface Material solutions such as thermal grease, thermal pads and silicones have been industry standards, however may fall short in performance for high temperature or high-power applications. This presentation will focus on development of a cutting-edge Die Attach Solution for Thermal Interface Management, focusing on Fusion Type epoxy-based Ag adhesive with an extremally low Storage Modulus and the Thermal Conductivity reaching up to 30W/mK, and also Very Low Modulus, Low-Temperature Pressureless Sintered Silver Die Attach with the Thermal Conductivity of 70W/mK.


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