2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: Characterisation methods and implementation in FEM

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2011.5765846 ◽

2011 ◽

Cited By ~ 2

Author(s):

A. Ivankovic ◽

K. Vanstreels ◽

YY Hsu ◽

M. Gonzalez ◽

G. Brizar ◽

...

Keyword(s):

Thermal Ageing ◽

Characterisation Methods

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Heat sink design for optimal thermal management

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2011.5765813 ◽

2011 ◽

Author(s):

D. Hofinger ◽

M. Jungwirth ◽

H. Pflugelmeier ◽

A. Eder

Keyword(s):

Thermal Management ◽

Heat Sink ◽

Heat Sink Design

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The influence of molecular dynamics simulation parameters on the accuracy of carbon nanotubes thermal conductivity calculations

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2011.5765854 ◽

2011 ◽

Author(s):

Bartosz Platek ◽

Tomasz Falat ◽

Jan Felba

Keyword(s):

Thermal Conductivity ◽

Carbon Nanotubes ◽

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

Dynamics Simulation ◽

Simulation Parameters

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Influence of multiphysics couplings on the performance of a MEMS magnetometer

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2011.5765803 ◽

2011 ◽

Cited By ~ 1

Author(s):

S. Ranvier ◽

S. Paquay ◽

S. Requier ◽

H. Lamy ◽

V. Rochus ◽

...

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Fatigue model based on average cross-section strain of Cu trace cyclic bending

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2011.5765858 ◽

2011 ◽

Cited By ~ 1

Author(s):

D. Farley ◽

A. Dasgupta ◽

Y. Zhou ◽

J.F.J. Caers ◽

J.W.C. De Vries

Keyword(s):

Cross Section ◽

Cyclic Bending ◽

Average Cross Section ◽

Model Based ◽

Fatigue Model

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LED system reliability

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2011.5765848 ◽

2011 ◽

Cited By ~ 17

Author(s):

W.D. van Driel ◽

C.A. Yuan ◽

S. Koh ◽

G.Q. Zhang

Keyword(s):

System Reliability

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Effects of the electrode positions on the dynamical behaviour of electrostatically actuated MEMS resonators

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2011.5765767 ◽

2011 ◽

Cited By ~ 4

Author(s):

M. Pustan ◽

S. Paquay ◽

V. Rochus ◽

J - C. Golinval

Keyword(s):

Dynamical Behaviour ◽

Electrostatically Actuated ◽

Mems Resonators

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Development of a standard for transient measurement of junction-to-case thermal resistance

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2011.5765862 ◽

2011 ◽

Cited By ~ 2

Author(s):

Heinz Pape ◽

Dirk Schweitzer ◽

Liu Chen ◽

Rudolf Kutscherauer ◽

Martin Walder

Keyword(s):

Thermal Resistance ◽

Transient Measurement

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Modelling aluminium wire bond reliability in high power OMP devices

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2011.5765790 ◽

2011 ◽

Cited By ~ 2

Author(s):

Rene Kregting ◽

Cadmus Yuan ◽

An Xiao ◽

Frank de Bruijn

Keyword(s):

High Power ◽

Wire Bond ◽

Aluminium Wire

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Impact of VDMOS source metallization ageing in 3D FEM wire lift off modeling

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2011.5765828 ◽

2011 ◽

Cited By ~ 1

Author(s):

E. Marcault ◽

T. Azoui ◽

P. Tounsi ◽

M. Breil ◽

A. Bourennane ◽

...

Keyword(s):

3D Fem ◽

Lift Off

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2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: Characterisation methods and implementation in FEM

Heat sink design for optimal thermal management

The influence of molecular dynamics simulation parameters on the accuracy of carbon nanotubes thermal conductivity calculations

Influence of multiphysics couplings on the performance of a MEMS magnetometer

Fatigue model based on average cross-section strain of Cu trace cyclic bending

LED system reliability

Effects of the electrode positions on the dynamical behaviour of electrostatically actuated MEMS resonators

Development of a standard for transient measurement of junction-to-case thermal resistance

Modelling aluminium wire bond reliability in high power OMP devices

Impact of VDMOS source metallization ageing in 3D FEM wire lift off modeling

Export Citation Format

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and MicrosystemsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: Characterisation methods and implementation in FEM

Heat sink design for optimal thermal management

The influence of molecular dynamics simulation parameters on the accuracy of carbon nanotubes thermal conductivity calculations

Influence of multiphysics couplings on the performance of a MEMS magnetometer

Fatigue model based on average cross-section strain of Cu trace cyclic bending

LED system reliability

Effects of the electrode positions on the dynamical behaviour of electrostatically actuated MEMS resonators

Development of a standard for transient measurement of junction-to-case thermal resistance

Modelling aluminium wire bond reliability in high power OMP devices

Impact of VDMOS source metallization ageing in 3D FEM wire lift off modeling

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Latest Publications