Die Pop Challenge and Comprehensive Solutions in Vacuum Reflow Technology for Semiconductor Packaging

2018 ◽  
Author(s):  
Siang Miang Yeo ◽  
Azman Mahmood ◽  
Nur Afifah Md Yazid
Keyword(s):  
Semiconductor Packaging

Quality Monitoring and Prospects of Wire Bonding

2012 ◽  
Vol 588-589 ◽  
pp. 1156-1160
Author(s):  
Ge Ge Mei ◽  
Bin Jin ◽  
Wei Gong
Keyword(s):  
Process Parameters ◽  
Wire Bonding ◽  
Quality Monitoring ◽  
Main Trend ◽  
Microelectronic Packaging ◽  
Main Process ◽  
Bonding Quality ◽  
Semiconductor Packaging

Wire bonding is rapidly developmental technology of microelectronic packaging nearly half a century and become the main trend of semiconductor packaging field currently. This article introduces the main process parameters influencing on bonding quality, the methods to improve the bonding reliability, and prospects of developmental tendency of wire bonding.

scholarly journals Impact Modifiers and Compatibilizers for Versatile Epoxy-Based Adhesive Films with Curing and Deoxidizing Capabilities

Polymers ◽  
2021 ◽  
Vol 13 (7) ◽  
pp. 1129
Author(s):  
Bo-Young Lee ◽  
Dae-Hyeon Lee ◽  
Keon-Soo Jang
Keyword(s):  
Mechanical Properties ◽  
Epoxy Resins ◽  
Film Formation ◽  
Electronic Devices ◽  
Amorphous Polymers ◽  
Acidic Group ◽  
Adhesive Film ◽  
Acidic Compounds ◽  
Semiconductor Packaging ◽  
Compatibilizing Agent

Epoxy resins with acidic compounds feature adhesion, robustness, and deoxidizing ability. In this study, hybrid adhesive films with deoxidizing and curing capabilities for semiconductor packaging were fabricated. The compatibilizing effects and mechanical properties were chiefly investigated by using various additive binders (thermoplastic amorphous polymers) and compatibilizing agents. The curing, deoxidizing, thermal, and rheological properties were systematically investigated. For uniform film formation and maximizing deoxidizing curable abilities, a thermoplastic--thermoset mixture containing a phenyl and carboxylic acid-based additive (benzoic acid), and a polycarbonate was chosen as the model adhesive film. Without either a phenyl or an acidic group in the compatibilizing agent, deoxidizing and compatibilizing effects were not achieved. The manufactured hybrid adhesive film can be effectively used, especially for electronic devices that require deoxidization and adhesion.

The wire sweep analysis based on the evaluation of the bending and twisting moments for semiconductor packaging

2006 ◽  
Vol 83 (10) ◽  
pp. 1931-1939 ◽  
Author(s):  
Huang-Kuang Kung ◽  
Jeng-Nan Lee ◽  
Chin-Yu Wang
Keyword(s):  
The Wire ◽  
Semiconductor Packaging

Synthesis and practicability of novel additives for copper electroplating with semiconductor packaging

2005 ◽  
Vol 96 (3) ◽  
pp. 837-840 ◽  
Author(s):  
Masaharu Sugimoto ◽  
Kazuki Yamaguchi ◽  
Hiroaki Kouzai ◽  
Hideo Honma
Keyword(s):  
Copper Electroplating ◽  
Semiconductor Packaging
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