Post-curing Influence on Electrostatic Charges Deposited on Epoxy/Silica Composites used for Microelectronic Packaging
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2002 ◽
Vol 94
(1)
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pp. 48-53
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2012 ◽
Vol 588-589
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pp. 1156-1160
2017 ◽
Vol 57
(4)
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pp. 603-614
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