4th Electronics Packaging Technology Conference, 2002.
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An adaptable compact thermal model for BGA packages

2003 ◽  
Author(s):  
Ming Xie ◽  
Kok Chuan Toh ◽  
D. Pinjala
Keyword(s):  
Thermal Model ◽  
Bga Packages

Yield estimation for BGA assembly

2003 ◽  
Author(s):  
S.S. Phadnis ◽  
K. Srihari ◽  
V. Yamunan
Keyword(s):  
Yield Estimation

Over GHz frequency model of commercial 2mm hard metric connector using on-board calibration standards

2003 ◽  
Author(s):  
Seungyong Baek ◽  
Bong Cheol Park ◽  
Dong Gun Kam ◽  
Joungho Kim
Keyword(s):  
Frequency Model ◽  
Calibration Standards

In-situ reliability analysis of solder joint by digital image correlation

2003 ◽  
Author(s):  
J.H.L. Pang ◽  
X.K. Zhang ◽  
Q.J. Liu ◽  
F.X. Che ◽  
T.H. Low ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Solder Joint ◽  
Reliability Analysis ◽  
Digital Image ◽  
Image Correlation

Flip chip interfacial behavior under thermal testing

2003 ◽  
Author(s):  
Z.W. Zhong ◽  
X.Q. Shi ◽  
K.W. Wong ◽  
Z.P. Wang
Keyword(s):  
Flip Chip ◽  
Thermal Testing ◽  
Interfacial Behavior
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