Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146)
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780364821

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Low-thermal-resistance flip-chip fine package for 1-W voltage regulator IC

Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146) ◽

10.1109/iemt.2000.910742 ◽

2002 ◽

Cited By ~ 5

Author(s):

F. Takamura ◽

K. Tanaka ◽

K. Mitsuka ◽

H. Matsushita

Keyword(s):

Thermal Resistance ◽

Flip Chip ◽

Voltage Regulator

Download Full-text

Effect of voids on the reliability of BGA/CSP solder joints

Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146) ◽

10.1109/iemt.2000.910730 ◽

2002 ◽

Cited By ~ 9

Author(s):

M. Yunus ◽

A. Primavera ◽

K. Srihari ◽

J.M. Pitarresi

Keyword(s):

Solder Joints

Download Full-text

Characterization of lead-free solder by reliability testing

Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146) ◽

10.1109/iemt.2000.910737 ◽

2002 ◽

Cited By ~ 2

Author(s):

S.-R. Tzan ◽

S.-L. Chu

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Reliability Testing ◽

Free Solder

Download Full-text

The new gremlins of refurbishing complex step manufacturing tools for user-defined computerized automation

Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146) ◽

10.1109/iemt.2000.910747 ◽

2002 ◽

Author(s):

D.E. Barrett

Download Full-text

Optimising process parameters for flip chip stencil printing using Taguchi's method

Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146) ◽

10.1109/iemt.2000.910751 ◽

2002 ◽

Cited By ~ 3

Author(s):

D. Rajkumar ◽

T. Nguty ◽

N.N. Ekere

Keyword(s):

Process Parameters ◽

Flip Chip ◽

Taguchi’S Method ◽

Stencil Printing

Download Full-text

A process and reliability analysis of no flow underfill materials for high throughput flip chip processing

Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146) ◽

10.1109/iemt.2000.910727 ◽

2002 ◽

Author(s):

B.A. Smith ◽

R. Thorpe ◽

D.F. Baldwin

Keyword(s):

Reliability Analysis ◽

High Throughput ◽

Flip Chip ◽

Chip Processing

Download Full-text

Array sockets and connectors using MicroSpring/sup TM/ technology

Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146) ◽

10.1109/iemt.2000.910721 ◽

2002 ◽

Cited By ~ 10

Author(s):

N.L. Tracy ◽

R. Rothenberger ◽

C. Copper ◽

N. Corman ◽

G. Biddle ◽

...

Download Full-text

Yield prediction models for optimization of high-speed micro-processor manufacturing processes

Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146) ◽

10.1109/iemt.2000.910748 ◽

2002 ◽

Author(s):

Tae Seon Kim ◽

Se Hwan Ahn ◽

Young Gyun Jang ◽

Jeong In Lee ◽

Kil Jae Lee ◽

...

Keyword(s):

High Speed ◽

Prediction Models ◽

Manufacturing Processes ◽

Yield Prediction

Download Full-text

Thru-silicon interconnect technology

Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146) ◽

10.1109/iemt.2000.910720 ◽

2002 ◽

Cited By ~ 2

Author(s):

S. Savastiouk ◽

O. Siniaguine ◽

J. Reche ◽

E. Korczynski

Keyword(s):

Interconnect Technology

Download Full-text

Plastic solder paste stencil for surface mount technology

Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146) ◽

10.1109/iemt.2000.910741 ◽

2002 ◽

Cited By ~ 4

Author(s):

C.K. Wong ◽

D.J. Waldorf ◽

L. Rinzel

Keyword(s):

Surface Mount Technology ◽

Solder Paste ◽

Surface Mount

Download Full-text

Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Low-thermal-resistance flip-chip fine package for 1-W voltage regulator IC

Effect of voids on the reliability of BGA/CSP solder joints

Characterization of lead-free solder by reliability testing

The new gremlins of refurbishing complex step manufacturing tools for user-defined computerized automation

Optimising process parameters for flip chip stencil printing using Taguchi's method

A process and reliability analysis of no flow underfill materials for high throughput flip chip processing

Array sockets and connectors using MicroSpring/sup TM/ technology

Yield prediction models for optimization of high-speed micro-processor manufacturing processes

Thru-silicon interconnect technology

Plastic solder paste stencil for surface mount technology

Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146)
Latest Publications