2007 IEEE Electrical Performance of Electronic Packaging
Latest Publications

TOTAL DOCUMENTS

104

(FIVE YEARS 0)

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10

(FIVE YEARS 0)

Published By IEEE

9781424408832

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Swarm Intelligence for Electrical Design Space Exploration

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387113 ◽

2007 ◽

Author(s):

Navraj Singh ◽

Bhyrav Mutnury ◽

Caleb Wesley ◽

Nam Pham ◽

Erdem Matoglu ◽

...

Keyword(s):

Swarm Intelligence ◽

Design Space Exploration ◽

Design Space ◽

Space Exploration

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Design, Analysis, and Optimization of DDR2 Memory Power Delivery Network

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387131 ◽

2007 ◽

Author(s):

Junho Lee ◽

Hyunseok Kim ◽

Kimyung Kyung ◽

Minyoung You ◽

Hyungdong Lee ◽

...

Keyword(s):

Design Analysis ◽

Power Delivery ◽

Power Delivery Network ◽

Memory Power ◽

Delivery Network

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Characterization of Metamaterial Interconnects

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387163 ◽

2007 ◽

Author(s):

Asanee Suntives ◽

Arash Khajooeizadeh ◽

Ramesh Abhari

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Package Performance Improvement with Counter-Discontinuity and its Effective Bandwidth

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387150 ◽

2007 ◽

Author(s):

Nanju Na ◽

Mark Bailey ◽

Asad Kalantarian

Keyword(s):

Performance Improvement ◽

Effective Bandwidth

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Multi-Rate FDTD Method for Fast Electromagnetic Simulation

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387182 ◽

2007 ◽

Author(s):

Yuya Nakazono ◽

Hideki Asai

Keyword(s):

Fdtd Method ◽

Electromagnetic Simulation

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An Efficient 3D-to-2D Reduction Technique for Frequency-Domain Layered Finite Element Analysis of Large-Scale High-Frequency Integrated Circuits

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387185 ◽

2007 ◽

Author(s):

Feng Sheng ◽

Sourav Chakravarty ◽

Dan Jiao

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Integrated Circuits ◽

Frequency Domain ◽

High Frequency ◽

Large Scale ◽

Reduction Technique ◽

Element Analysis

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Jitter Amplification Considerations for PCB Clock Channel Design

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387143 ◽

2007 ◽

Author(s):

Chris Madden ◽

Sam Chang ◽

Dan Oh ◽

Chuck Yuan

Keyword(s):

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Fast Macromodeling Technique of Sampled Time/Frequency Data Using z-domain Vector-Fitting Method

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387120 ◽

2007 ◽

Author(s):

Yidnek S. Mekonnen ◽

Jose E. Schutt-Aine

Keyword(s):

Frequency Data ◽

Time Frequency ◽

Vector Fitting ◽

Fitting Method ◽

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Study of High Speed Current Excitation Reverse Engineering Methodology Using Measured Voltage and PDN Impedance Profile from a Running Microprocessor

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387191 ◽

2007 ◽

Author(s):

Huang Jimmy Huat Since ◽

Bin Yusof Ahmad Jalaluddin ◽

Ong Alvin Yih Yeong

Keyword(s):

Reverse Engineering ◽

Measured Voltage ◽

Impedance Profile

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Efficient, Automatic Model Order Determination and Model Generation for Tabulated S-parameters

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387187 ◽

2007 ◽

Author(s):

Mengmeng Ding ◽

David Smart

Keyword(s):

Model Generation ◽

Model Order ◽

S Parameters ◽

Model Order Determination ◽

Order Determination

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