2007 IEEE Electrical Performance of Electronic Packaging
Latest Publications

TOTAL DOCUMENTS

104

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424408832

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Multi-Rate FDTD Method for Fast Electromagnetic Simulation

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387182 ◽

2007 ◽

Author(s):

Yuya Nakazono ◽

Hideki Asai

Keyword(s):

Fdtd Method ◽

Electromagnetic Simulation

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An Efficient 3D-to-2D Reduction Technique for Frequency-Domain Layered Finite Element Analysis of Large-Scale High-Frequency Integrated Circuits

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387185 ◽

2007 ◽

Cited By ~ 4

Author(s):

Feng Sheng ◽

Sourav Chakravarty ◽

Dan Jiao

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Integrated Circuits ◽

Frequency Domain ◽

High Frequency ◽

Large Scale ◽

Reduction Technique ◽

Element Analysis

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Jitter Amplification Considerations for PCB Clock Channel Design

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387143 ◽

2007 ◽

Cited By ~ 16

Author(s):

Chris Madden ◽

Sam Chang ◽

Dan Oh ◽

Chuck Yuan

Keyword(s):

Channel Design

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Swarm Intelligence for Electrical Design Space Exploration

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387113 ◽

2007 ◽

Cited By ~ 1

Author(s):

Navraj Singh ◽

Bhyrav Mutnury ◽

Caleb Wesley ◽

Nam Pham ◽

Erdem Matoglu ◽

...

Keyword(s):

Swarm Intelligence ◽

Design Space Exploration ◽

Design Space ◽

Space Exploration

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Design, Analysis, and Optimization of DDR2 Memory Power Delivery Network

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387131 ◽

2007 ◽

Cited By ~ 2

Author(s):

Junho Lee ◽

Hyunseok Kim ◽

Kimyung Kyung ◽

Minyoung You ◽

Hyungdong Lee ◽

...

Keyword(s):

Design Analysis ◽

Power Delivery ◽

Power Delivery Network ◽

Memory Power ◽

Delivery Network

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Characterization of Metamaterial Interconnects

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387163 ◽

2007 ◽

Cited By ~ 1

Author(s):

Asanee Suntives ◽

Arash Khajooeizadeh ◽

Ramesh Abhari

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Package Performance Improvement with Counter-Discontinuity and its Effective Bandwidth

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387150 ◽

2007 ◽

Cited By ~ 5

Author(s):

Nanju Na ◽

Mark Bailey ◽

Asad Kalantarian

Keyword(s):

Performance Improvement ◽

Effective Bandwidth

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Extended Segmentation Procedure for Electromagnetic Modeling of the Power Distribution Network

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387125 ◽

2007 ◽

Cited By ~ 4

Author(s):

Varvara Kollia ◽

Andreas C. Cangellaris

Keyword(s):

Power Distribution ◽

Distribution Network ◽

Electromagnetic Modeling ◽

Power Distribution Network

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A Domain Decomposition Method for the Finite Element Simulation of Circuit Board Interconnects

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387181 ◽

2007 ◽

Author(s):

Kaiyu Mao ◽

Jilin Tan ◽

Jian-Ming Jin

Keyword(s):

Finite Element ◽

Domain Decomposition ◽

Finite Element Simulation ◽

Decomposition Method ◽

Domain Decomposition Method ◽

Circuit Board ◽

Element Simulation

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Fast Macromodeling Technique of Sampled Time/Frequency Data Using z-domain Vector-Fitting Method

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387120 ◽

2007 ◽

Cited By ~ 5

Author(s):

Yidnek S. Mekonnen ◽

Jose E. Schutt-Aine

Keyword(s):

Frequency Data ◽

Time Frequency ◽

Vector Fitting ◽

Fitting Method ◽

Z Domain

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2007 IEEE Electrical Performance of Electronic PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Multi-Rate FDTD Method for Fast Electromagnetic Simulation

An Efficient 3D-to-2D Reduction Technique for Frequency-Domain Layered Finite Element Analysis of Large-Scale High-Frequency Integrated Circuits

Jitter Amplification Considerations for PCB Clock Channel Design

Swarm Intelligence for Electrical Design Space Exploration

Design, Analysis, and Optimization of DDR2 Memory Power Delivery Network

Characterization of Metamaterial Interconnects

Package Performance Improvement with Counter-Discontinuity and its Effective Bandwidth

Extended Segmentation Procedure for Electromagnetic Modeling of the Power Distribution Network

A Domain Decomposition Method for the Finite Element Simulation of Circuit Board Interconnects

Fast Macromodeling Technique of Sampled Time/Frequency Data Using z-domain Vector-Fitting Method

2007 IEEE Electrical Performance of Electronic Packaging
Latest Publications