2021 ◽  
Author(s):  
Arie van der Lee ◽  
Dan George Dumitrescu

Abstract The thermal expansion properties of crystalline organic compounds are investigated by data mining of the Cambridge Structural Database (CSD). The mean volumetric thermal expansion coefficient is 168.8 10-6K-1 and...


2018 ◽  
Vol 60 (5) ◽  
pp. 964
Author(s):  
Zhiqin Wen ◽  
Yuhong Zhao ◽  
Hua Hou ◽  
Liwen Chen

AbstractFirst-principles calculations are performed to investigate lattice parameters, elastic constants and 3D directional Young’s modulus E of nickel silicides (i.e., β-Ni_3Si, δ-Ni_2Si, θ-Ni_2Si, ε-NiSi, and θ-Ni_2Si), and thermodynamic properties, such as the Debye temperature, heat capacity, volumetric thermal expansion coefficient, at finite temperature are also explored in combination with the quasi-harmonic Debye model. The calculated results are in a good agreement with available experimental and theoretical values. The five compounds demonstrate elastic anisotropy. The dependence on the direction of stiffness is the greatest for δ-Ni_2Si and θ-Ni_2Si, when the stress is applied, while that for β-Ni_3Si is minimal. The bulk modulus B reduces with increasing temperature, implying that the resistance to volume deformation will weaken with temperature, and the capacity gradually descend for the compound sequence of β-Ni_3Si > δ-Ni_2Si > θ-Ni_2Si > ε-NiSi > θ-Ni_2Si. The temperature dependence of the Debye temperature ΘD is related to the change of lattice parameters, and ΘD gradually decreases for the compound sequence of ε-NiSi > β-Ni_3Si > δ-Ni_2Si > θ-Ni_2Si > θ-Ni_2Si. The volumetric thermal expansion coefficient αV, isochoric heat capacity and isobaric heat capacity C _ p of nickel silicides are proportional to T ^3 at low temperature, subsequently, αV and C _ p show modest linear change at high temperature, whereas C _v obeys the Dulong-Petit limit. In addition, β-Ni_3Si has the largest capability to store or release heat at high temperature. From the perspective of solid state physics, the thermodynamic properties at finite temperature can be used to guide further experimental works and design of novel nickel–silicon alloys.


Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 153
Author(s):  
Chuen-Lin Tien ◽  
Tsai-Wei Lin

This paper proposes a measuring apparatus and method for simultaneous determination of the thermal expansion coefficient and biaxial Young’s modulus of indium tin oxide (ITO) thin films. ITO thin films simultaneously coated on N-BK7 and S-TIM35 glass substrates were prepared by direct current (DC) magnetron sputtering deposition. The thermo-mechanical parameters of ITO thin films were investigated experimentally. Thermal stress in sputtered ITO films was evaluated by an improved Twyman–Green interferometer associated with wavelet transform at different temperatures. When the heating temperature increased from 30 °C to 100 °C, the tensile thermal stress of ITO thin films increased. The increase in substrate temperature led to the decrease of total residual stress deposited on two glass substrates. A linear relationship between the thermal stress and substrate heating temperature was found. The thermal expansion coefficient and biaxial Young’s modulus of the films were measured by the double substrate method. The results show that the out of plane thermal expansion coefficient and biaxial Young’s modulus of the ITO film were 5.81 × 10−6 °C−1 and 475 GPa.


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