Curing kinetics of epoxy resin–imidazole–organic montmorillonite nanocomposites determined by differential scanning calorimetry

2003 ◽  
Vol 88 (13) ◽  
pp. 2932-2941 ◽  
Author(s):  
Wei-Bing Xu ◽  
Su-Ping Bao ◽  
Shi-Jun Shen ◽  
Guo-Pei Hang ◽  
Ping-Sheng He
Keyword(s):  
Differential Scanning Calorimetry ◽  
Epoxy Resin ◽  
Curing Kinetics ◽  
Scanning Calorimetry ◽  
Organic Montmorillonite ◽  
Kinetics Of ◽  
Montmorillonite Nanocomposites

An improved simplified approach for curing kinetics of epoxy resins by nonisothermal differential scanning calorimetry

2017 ◽  
Vol 30 (3) ◽  
pp. 303-311 ◽  
Author(s):  
Chao Chen ◽  
Yanxia Li ◽  
Yizhuo Gu ◽  
Min Li ◽  
Zuoguang Zhang
Keyword(s):  
Differential Scanning Calorimetry ◽  
Epoxy Resin ◽  
Kinetic Parameters ◽  
Epoxy Resins ◽  
Curing Kinetics ◽  
Scanning Calorimetry ◽  
Simplified Approach ◽  
Curing Kinetic ◽  
Autocatalytic Curing ◽  
Kinetics Of

The curing kinetics of two different types of commercial epoxy resins were investigated by means of nonisothermal differential scanning calorimetry (DSC) in this work. The complex curve of measured heat flow of CYCOM 970 epoxy resin was simplified with the method of resolution of peak. Two typical autocatalytic curing reaction curves were gained and the kinetic parameters of the curing process were demonstrated by combination of those two reactions. The Kissinger method was adopted to obtain the values of the activation energy. The parameters of curing kinetic model were acquired according to the fitting of Kamal model. Isothermal DSC curve of CYCOM 970 epoxy resin obtained using the experimental data shows a good agreement with that theoretically calculated. Then, 603 epoxy resin was investigated by the simplified method and the kinetic parameters were received through the same procedure. The nonisothermal DSC curve tested according to the recommended cure cycle of 603 epoxy resin is also consistent with the calculated results. This improved simplified approach provides an effective method to analyze the curing kinetics of the epoxy resins with complex DSC curves as similar to this study.

Curing Kinetics of Silicone Epoxy Resin Containing Fluorene

2014 ◽  
Vol 936 ◽  
pp. 28-33 ◽  
Author(s):  
Wei Xing Deng ◽  
Yuan Wei Zhong ◽  
Jie Qin ◽  
Xue Bing Huang ◽  
Jin Wen Peng
Keyword(s):  
Activation Energy ◽  
Differential Scanning Calorimetry ◽  
Ftir Spectroscopy ◽  
Epoxy Resin ◽  
1H Nmr ◽  
Chemical Structure ◽  
Curing Kinetics ◽  
Curing Agent ◽  
Scanning Calorimetry ◽  
Kinetics Of

A new epoxy resin based on dichlorosilane and 9,9-bis (4-hydroxyphenyl) fluorene was synthesized to produce a highly heat-resistant network. The chemical structure was characterized with FTIR spectroscopy and 1H-NMR. 4-4′-Diaminodiphenylsulfone (DDS) was used as the curing agent. The curing kinetics of different epoxy/DDS systems were investigated using non-isothermal differential scanning calorimetry (DSC). The results showed that the values of activation energy (E) were affected by the chemical structure of epoxy resin, and BPEBF exhibited lower curing reactivity towards DDS compared to E-51.

Study on Curing Kinetics of MEP-15/593/660 System

2014 ◽  
Vol 988 ◽  
pp. 31-35
Author(s):  
Jia Le Song ◽  
Chan Chan Li ◽  
Zhi Mi Zhou ◽  
Chao Qiang Ye ◽  
Wei Guang Li
Keyword(s):  
Activation Energy ◽  
Differential Scanning Calorimetry ◽  
Kinetic Parameters ◽  
Curing Kinetics ◽  
Conversion Ratio ◽  
Scanning Calorimetry ◽  
Degree Of Cure ◽  
Curing Kinetic ◽  
The Relationship ◽  
Kinetics Of

Curing kinetics of MEP-15/593 system and MEP-15/593/660 system is studied by means of differential scanning calorimetry (DSC). Curing kinetic parameters are evaluated and the relationship between diluent 660 and the curing properties is investigated. The results show that the diluent 660 can not only reduce viscosity and activation energy, but also improve the degree of cure and conversion ratio.

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