Curing Kinetics of Silicone Epoxy Resin Containing Fluorene

2014 ◽  
Vol 936 ◽  
pp. 28-33 ◽  
Author(s):  
Wei Xing Deng ◽  
Yuan Wei Zhong ◽  
Jie Qin ◽  
Xue Bing Huang ◽  
Jin Wen Peng
Keyword(s):  
Activation Energy ◽  
Differential Scanning Calorimetry ◽  
Ftir Spectroscopy ◽  
Epoxy Resin ◽  
1H Nmr ◽  
Chemical Structure ◽  
Curing Kinetics ◽  
Curing Agent ◽  
Scanning Calorimetry ◽  
Kinetics Of

A new epoxy resin based on dichlorosilane and 9,9-bis (4-hydroxyphenyl) fluorene was synthesized to produce a highly heat-resistant network. The chemical structure was characterized with FTIR spectroscopy and 1H-NMR. 4-4′-Diaminodiphenylsulfone (DDS) was used as the curing agent. The curing kinetics of different epoxy/DDS systems were investigated using non-isothermal differential scanning calorimetry (DSC). The results showed that the values of activation energy (E) were affected by the chemical structure of epoxy resin, and BPEBF exhibited lower curing reactivity towards DDS compared to E-51.

Study on Curing Kinetics of MEP-15/593/660 System

2014 ◽  
Vol 988 ◽  
pp. 31-35
Author(s):  
Jia Le Song ◽  
Chan Chan Li ◽  
Zhi Mi Zhou ◽  
Chao Qiang Ye ◽  
Wei Guang Li
Keyword(s):  
Activation Energy ◽  
Differential Scanning Calorimetry ◽  
Kinetic Parameters ◽  
Curing Kinetics ◽  
Conversion Ratio ◽  
Scanning Calorimetry ◽  
Degree Of Cure ◽  
Curing Kinetic ◽  
The Relationship ◽  
Kinetics Of

Curing kinetics of MEP-15/593 system and MEP-15/593/660 system is studied by means of differential scanning calorimetry (DSC). Curing kinetic parameters are evaluated and the relationship between diluent 660 and the curing properties is investigated. The results show that the diluent 660 can not only reduce viscosity and activation energy, but also improve the degree of cure and conversion ratio.

An improved simplified approach for curing kinetics of epoxy resins by nonisothermal differential scanning calorimetry

2017 ◽  
Vol 30 (3) ◽  
pp. 303-311 ◽  
Author(s):  
Chao Chen ◽  
Yanxia Li ◽  
Yizhuo Gu ◽  
Min Li ◽  
Zuoguang Zhang
Keyword(s):  
Differential Scanning Calorimetry ◽  
Epoxy Resin ◽  
Kinetic Parameters ◽  
Epoxy Resins ◽  
Curing Kinetics ◽  
Scanning Calorimetry ◽  
Simplified Approach ◽  
Curing Kinetic ◽  
Autocatalytic Curing ◽  
Kinetics Of

The curing kinetics of two different types of commercial epoxy resins were investigated by means of nonisothermal differential scanning calorimetry (DSC) in this work. The complex curve of measured heat flow of CYCOM 970 epoxy resin was simplified with the method of resolution of peak. Two typical autocatalytic curing reaction curves were gained and the kinetic parameters of the curing process were demonstrated by combination of those two reactions. The Kissinger method was adopted to obtain the values of the activation energy. The parameters of curing kinetic model were acquired according to the fitting of Kamal model. Isothermal DSC curve of CYCOM 970 epoxy resin obtained using the experimental data shows a good agreement with that theoretically calculated. Then, 603 epoxy resin was investigated by the simplified method and the kinetic parameters were received through the same procedure. The nonisothermal DSC curve tested according to the recommended cure cycle of 603 epoxy resin is also consistent with the calculated results. This improved simplified approach provides an effective method to analyze the curing kinetics of the epoxy resins with complex DSC curves as similar to this study.

Curing Kinetics of Octaepoxysilsesquioxane/DDS System

2011 ◽  
Vol 233-235 ◽  
pp. 1834-1837
Author(s):  
Zeng Ping Zhang ◽  
Jian Zhong Pei ◽  
Shuan Fa Chen ◽  
Hong Zhao Du ◽  
Yong Wen
Keyword(s):  
Activation Energy ◽  
Differential Scanning Calorimetry ◽  
Curing Kinetics ◽  
Scanning Calorimetry ◽  
Exponential Factor ◽  
Inorganic Hybrid ◽  
Oligomeric Silsesquioxane ◽  
Kinetics Of ◽  
Epoxy Groups ◽  
Important Kind

Polyhedral oligomeric silsesquioxane (POSS) can be incorporated into polymers to obtain organic/inorganic hybrid materials. Octaepoxysilsesquioxane (E-POSS) with eight reactive epoxy groups per molecule is an important kind of POSS. E-POSS was cured with 4,4'-diaminodiphenylsulfone diamine (DDS) in this study. The curing kinetics of the E-POSS/DDS system was studied by using differential scanning calorimetry (DSC). Kinssinger and Flynn-Wall-Ozawa methods were used to obtain the activation energy and pre-exponential factor of the curing reaction.

Curing Kinetics of Cyano Functionalized Benzoxazine

2011 ◽  
Vol 233-235 ◽  
pp. 2337-2340
Author(s):  
Wen Jin Chen ◽  
Xiao Bo Liu
Keyword(s):  
Activation Energy ◽  
Thermal Stability ◽  
Differential Scanning Calorimetry ◽  
Theoretical Calculations ◽  
Curing Kinetics ◽  
High Thermal Stability ◽  
Order Model ◽  
Scanning Calorimetry ◽  
Autocatalytic Model ◽  
Kinetics Of

A multifunctional benzoxazine monomer (BZCN) was synthesized, which has several outstanding properties, such as high thermal stability and high glass transition. To better understand the curing kinetics of BZCN, isothermal differential scanning calorimetry measurements were used to determine the kinetic parameters and the kinetic models of the curing processes of benzoxazine monomer with cyano functionality. The result shows the mechanism of the curing reaction of BZCN exhibits autocatalytic model, but doesn’t meet nth-order model. Owing to the effects of catalysis of cyano functionality, the activation energy is 89.65KJ•mol-1and the total order of reaction is 1.84, which is quite different from that of normal benzoxazine. The theoretical calculations matched reasonably well with the experimental results.

Curing Kinetics of Octaepoxysilsesquioxane/MNA System

2011 ◽  
Vol 84-85 ◽  
pp. 42-46
Author(s):  
Zeng Ping Zhang ◽  
Guo Zheng Liang ◽  
Shuan Fa Chen
Keyword(s):  
Activation Energy ◽  
Differential Scanning Calorimetry ◽  
Hybrid Materials ◽  
Curing Kinetics ◽  
Scanning Calorimetry ◽  
Exponential Factor ◽  
Inorganic Hybrid ◽  
Oligomeric Silsesquioxane ◽  
Kinetics Of ◽  
Epoxy Groups

Polyhedral oligomeric silsesquioxane (POSS) can be added to polymers to prepare the organic/inorganic hybrid materials. Octaepoxysilsesquioxane (E-POSS) containing eight reactive epoxy groups in a molecule is one of the important POSSs. E-POSS was cured with methylnadic anhydride (MNA) in this study. The curing kinetics of the E-POSS/MNA system was studied by using differential scanning calorimetry (DSC). Two different kinds of methods, Kinssinger and Flynn-Wall-Ozawa, were used to calculate the activation energy and pre-exponential factor of the curing reaction.

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