Adhesion mechanisms in the solid-state bonding technique using submicrometer aromatic thermosetting copolyester adhesive

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pp. 3843-3856 ◽  
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John C. Selby ◽  
Mark A. Shannon ◽  
James Economy
Keyword(s):  
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Solid State Bonding ◽  
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Author(s):  
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Vol 67 ◽  
pp. 35-45
Author(s):  
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Wei Wang ◽  
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1991 ◽  
Vol 179-181 ◽  
pp. 1166
Author(s):  
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T. Higuchi ◽  
Y. Fujino
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scholarly journals Solid-state bonding of HAp using superplastic ceramics

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scholarly journals SOLID STATE BONDING OF ALUMINUM AND NICKEL

1953 ◽  
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H.H. Hausner
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Solid State Bonding
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