Investigation on solid state bonding and intermetallic compounds reaction of Cu pillar bump/Ni micro cones

2018 ◽  
Author(s):  
Yukun Guo ◽  
Anmin Hu ◽  
Ming Li
Keyword(s):  
Solid State ◽  
Intermetallic Compounds ◽  
Solid State Bonding ◽  
Cu Pillar ◽  
Cu Pillar Bump

scholarly journals Inhibiting Effects of the Ni Barrier Layer on the Growth of Porous Cu3sn in 10 μm Microbumps

2021 ◽  
Author(s):  
Siyan Liu ◽  
Chenlin Yang ◽  
huiqin Ling ◽  
Anmin Hu ◽  
Tao Hang ◽  
...  
Keyword(s):  
Phase Transition ◽  
Intermetallic Compounds ◽  
Barrier Layer ◽  
Growth Behavior ◽  
X Ray Diffraction ◽  
Potential Threat ◽  
X Ray ◽  
Cu Pillar ◽  
Cu Pillar Bump

Abstract With the shrinkage of size, porous Cu3Sn have become a new potential threat of the reliability in micron Cu pillar bump. The formation of porous Cu3Sn is contributed the decomposition of Cu6Sn5, which is caused by the overgrowth of intermetallic compounds (IMC) and the stress introduced by the phase transition of Cu6Sn5. In this paper, uniform Ф10 µm Cu/Sn and Cu/Ni (~0.6 μm)/Sn microbumps have been fabricated by multilayer electrodeposition and the effect of the Ni layer on the growth behavior of porous Cu3Sn was investigated by comparing the evolution of IMC in Cu/Sn and Cu/Ni/Sn bumps aged at 170 ℃ and 200 ℃. The ~0.6 μm Ni layer can effectively retard the Cu atoms diffusion, which can hinder IMC from overgrowth. Moreover, with the help of X-ray diffraction (XRD), the ability of the Ni layer in stabilizing Cu6Sn5 phase is strengthened, which weakens the tendency of the porous Cu3Sn formation. Under the conjoint action of retarding the growth of IMC and stabilizing Cu6Sn5 phase, the Ni layer can inhibit the formation of porous Cu3Sn efficaciously.

Fe/Ni diffusion behavior in the shear-extrusion solid state bonding process

2021 ◽  
Vol 67 ◽  
pp. 35-45
Author(s):  
Shuangjie Zhang ◽  
Wei Wang ◽  
Shibo Ma ◽  
Qiang Li
Keyword(s):  
Solid State ◽  
Bonding Process ◽  
Diffusion Behavior ◽  
Solid State Bonding

Solid-state bonding between vanadium alloys and alumina

1991 ◽  
Vol 179-181 ◽  
pp. 1166
Author(s):  
K. Abe ◽  
T. Higuchi ◽  
Y. Fujino
Keyword(s):  
Solid State ◽  
Vanadium Alloys ◽  
Solid State Bonding

Effects of α-Fe2O3 Additions on Assembly Reliability of Electroplated Sn-Based Solder Cap on Cu Pillar Bump During Thermal Cycling

2018 ◽  
Vol 48 (2) ◽  
pp. 1079-1090 ◽  
Author(s):  
Lijun Liu ◽  
Xiuchen Zhao ◽  
Ping Chen ◽  
Ying Liu ◽  
Yong Wang ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Cu Pillar ◽  
Cu Pillar Bump

scholarly journals Solid-state bonding of HAp using superplastic ceramics

2003 ◽  
Vol 2003 (0) ◽  
pp. 123-124
Author(s):  
Takashi SATO ◽  
Yoshinobu MOTOHASHI ◽  
Takaaki SAKUMA ◽  
Kazuyoshi WASEDA
Keyword(s):  
Solid State ◽  
Solid State Bonding

scholarly journals SOLID STATE BONDING OF ALUMINUM AND NICKEL

1953 ◽  
Author(s):  
S. Storchheim ◽  
J.L. Zambrow ◽  
H.H. Hausner
Keyword(s):  
Solid State ◽  
Solid State Bonding
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