Electroless copper plating on acrylonitrile butadiene styrene material surfaces without chromic acid etching and a palladium catalyst

Material Surfaces ◽

Electroless Copper ◽

Butadiene Styrene

Surface Modification of ABS for Electroless Copper Plating without Chromic Acid Etching

Recent Advances in Adhesion Science and Technology in Honor of Dr. Kash Mittal ◽

10.1201/b16347-9 ◽

2013 ◽

pp. 127-140

Author(s):

Norihiro Inagaki

Keyword(s):

Surface Modification ◽

Chromic Acid ◽

Acid Etching ◽

Copper Plating ◽

Nano Palladium Catalyst Formation Assisted by Ultrasound for Electroless Copper Plating

Nanoscience and Nanotechnology Letters ◽

10.1166/nnl.2017.2331 ◽

2017 ◽

Vol 9 (2) ◽

pp. 118-122 ◽

Cited By ~ 1

Author(s):

Hong-Kee Lee ◽

Chang-Myeon Lee ◽

Jin-Young Hur ◽

Seok-Bon Koo

Keyword(s):

Palladium Catalyst ◽

Copper Plating ◽

Electroless Copper ◽

Catalyst Formation

Inkjet printing of palladium catalyst patterns on polyimide film for electroless copper plating

Sensors and Actuators B Chemical ◽

10.1016/j.snb.2006.10.031 ◽

2007 ◽

Vol 123 (2) ◽

pp. 840-846 ◽

Cited By ~ 43

Author(s):

Stephan Busato ◽

Alberto Belloli ◽

Paolo Ermanni

Keyword(s):

Inkjet Printing ◽

Palladium Catalyst ◽

Polyimide Film ◽

Copper Plating ◽

Formation of Palladium Catalyst Containing Polysilsesquioxane Thin Film for Electroless Copper Plating

Journal of The Japan Institute of Electronics Packaging ◽

10.5104/jiep.18.479 ◽

2015 ◽

Vol 18 (7) ◽

pp. 479-485

Author(s):

Sayuri Teshima ◽

Kouichiro Murahashi ◽

Kuniaki Otsuka ◽

Koji Mitamura ◽

Seiji Watase ◽

...

Keyword(s):

Thin Film ◽

Palladium Catalyst ◽

Copper Plating ◽

Innovations in Corrosion and Materials Science (Formerly Recent Patents on Corrosion Science) ◽

Electroless Copper Plating of Titanium Condenser Tubes for Biofouling Control

10.2174/235209490601160428152630 ◽

2016 ◽

Vol 6 (1) ◽

pp. 65-73

Author(s):

Balakrishnan Anandkumar ◽

Rani P. George ◽

Alagarsamy Karthik ◽

Dasnamoorthy Ramachandran ◽

Uthandi Kamachi Mudali

Keyword(s):

Copper Plating ◽

Electroless Copper ◽

Biofouling Control

Novel fabrication of low-cost Ti–Cu alloy by electroless copper plating and vacuum sintering

Vacuum ◽

10.1016/j.vacuum.2021.110330 ◽

2021 ◽

pp. 110330

Author(s):

Chunming Wang ◽

Luming Zeng ◽

Wucheng Ding ◽

Tongxiang Liang

Keyword(s):

Low Cost ◽

Copper Plating ◽

Vacuum Sintering ◽

Cu Alloy ◽

Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board

Vacuum ◽

10.1016/j.vacuum.2019.108967 ◽

2019 ◽

Vol 170 ◽

pp. 108967 ◽

Cited By ~ 2

Author(s):

Yan Hong ◽

Xiangqing You ◽

Yi Zeng ◽

Yuanming Chen ◽

Yunzhong Huang ◽

...

Keyword(s):

Surface Modification ◽

Epoxy Resin ◽

Printed Circuit Board ◽

Circuit Board ◽

Copper Plating ◽

Air Plasma ◽

Plasma Surface ◽

Printed Circuit ◽

Selective Electroless Copper Plating on Poly(ethylene terephthalate) Surfaces by Microcontact Printing

Journal of The Electrochemical Society ◽

10.1149/1.3306136 ◽

2010 ◽

Vol 157 (4) ◽

pp. D222 ◽

Cited By ~ 12

Author(s):

Shih-Chun Huang ◽

Ting-Chieh Tsao ◽

Li-Jen Chen

Keyword(s):

Ethylene Terephthalate ◽

Microcontact Printing ◽

Copper Plating ◽

Poly Ethylene Terephthalate ◽

Electroless Copper ◽

Poly Ethylene

Electroless Copper Plating Using Glyoxylic Acid as a Reducing Agent.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.42.913 ◽

1991 ◽

Vol 42 (9) ◽

pp. 913-917 ◽

Cited By ~ 4

Author(s):

Hideo HONMA ◽

Motoaki KOMATSU ◽

Tomoyuki FUJINAMI

Keyword(s):

Glyoxylic Acid ◽

Reducing Agent ◽

Copper Plating ◽

New and clean strategy for the determination of Cu2+ in electroless copper plating baths

Spectrochimica Acta Part A Molecular and Biomolecular Spectroscopy ◽

10.1016/j.saa.2006.10.057 ◽

2007 ◽

Vol 68 (1) ◽

pp. 150-155 ◽

Cited By ~ 10

Author(s):

Rutao Liu ◽

Wansong Zong ◽

Canzhu Gao ◽

Zhenxing Chi ◽

Lijun Zhang

Keyword(s):

Copper Plating ◽