The electrical conductivity of CoO: Experimental results and a new conductivity model

The present studies are focused on the modification of the properties of epoxy resin with different additives namely aluminum, copper by preparing of composites systems with percentage (20%, 40% and 50%) of the above additives. The experimental results show that the D.C of conductivity on wt% filler content at ( 293-413 ) K electrical conductivity of all above composites increased with temperature for composites with filler contact and find the excellent electrical conductivity of copper and lie between (2.6*10-10 - 2.1*10-10)?.cm . The activation energy of the electrical conductivity is determined and found to decrease with increasing the filler concentration.

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Design and Fabrication of Micro Oxygen Sensor

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.483.237 ◽

2011 ◽

Vol 483 ◽

pp. 237-242

Author(s):

Chia Yen Lee ◽

Long Kai Lin Liou ◽

Chin Lung Chang ◽

Chang Hsing Tai ◽

Lung Ming Fu

Keyword(s):

Thin Film ◽

Electrical Conductivity ◽

Gas Sensor ◽

Oxygen Sensor ◽

Rf Sputtering ◽

Experimental Results ◽

Surface Pattern ◽

Working Temperature ◽

Measured Resistance ◽

Sensing Performance

In the study, a MEMS-based gas sensor is presented, which consists of a sensing thin film deposited by RF sputtering and annealed at 375°C. The structure and surface pattern of the thin film are analyzed by XRD and SEM. The sensor consists of a substrate, Pt interdigitated electrodes and an SnO2 sensing layer. As concentration of oxygen changes, a change in the electrical conductivity of the SnO2 film is caused. The experimental results show that the measured resistance increases as the concentration of oxygen increases at a working temperature of 300°C. A good oxygen sensing performance is presented in the study.

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Effect of Electrical Pulse Ageing on Microstructure and Properties of Cu-2.5Fe-0.03P-0.1Zn Copper Alloy

Materials Science Forum ◽

10.4028/www.scientific.net/msf.475-479.2635 ◽

2005 ◽

Vol 475-479 ◽

pp. 2635-2638

Author(s):

Jin Liang Huang ◽

Qiang Li ◽

Ping Liu ◽

Qi Ming Dong

Keyword(s):

Electrical Conductivity ◽

Theoretical Analysis ◽

Copper Alloy ◽

High Density ◽

Experimental Results ◽

Electrical Pulse ◽

Lead Frame ◽

Microstructure And Properties ◽

Nano Size ◽

The Ideal

Milisecond high density electrical pulse was used to age one of the typical IC lead frame materials Cu-2.5Fe-0.03P-0.1Zn copper alloy. The effects of electrical pulse aging on the microstructures, electrical conductivity and microhardness of this alloy were systematically investigated. The experimental results shown that the alloy phase precipitated in Cu-2.5Fe-0.03P-0.1Zn copper alloy during electrical pulse aging could be controlled to the order of nano-size and the ideal match of electrical conductivity and microhardness could be achieved in the condition of optimized parameters of electrical pulse. The electrical conductivity of the alloy was kept at above 60%IACS while the microhardness reached to HV115. A preliminary theoretical analysis was made to explain the unique action of electrical pulse.

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