Estimate the relative electrical conductivity of C–S–H gel from experimental results

2014 ◽  
Vol 71 ◽  
pp. 392-396 ◽  
Author(s):  
Hongyan Ma ◽  
Dongshuai Hou ◽  
Jun Liu ◽  
Zongjin Li
Keyword(s):  
Electrical Conductivity ◽  
Experimental Results ◽  
Relative Electrical Conductivity

scholarly journals Proposed mechanism of antibacterial mode of action of Caesalpinia bonducella seed oil against food-borne pathogens

2016 ◽  
Vol 11 (1) ◽  
pp. 257
Author(s):  
Shruti Shukla ◽  
Rajib Majumder ◽  
Laxmi Ahirwal ◽  
Archana Mehta
Keyword(s):  
Electrical Conductivity ◽  
Mode Of Action ◽  
Seed Oil ◽  
Membrane Integrity ◽  
Extracellular Atp ◽  
Potassium Ions ◽  
Food Borne ◽  
Absorbing Materials ◽  
Caesalpinia Bonducella ◽  
Relative Electrical Conductivity

<p class="Abstract">The antibacterial mechanism of action of <em>Caesalpinia bonducella</em> seed oil on membrane permeability of <em>Listeria monocytogenes</em> NCIM 24563 (MIC: 2 mg/mL) and <em>Escherichia coli</em> ATCC 25922 (MIC: 4 mg/mL) was determined by measuring the extracellular ATP concentration, release of 260-nm absorbing materials, leakage of potassium ions and measurement of relative electrical conductivity of the bacterial cells treated at MIC concentration. Its mode of action on membrane integrity was confirmed by release of extracellular ATP (1.42 and 1.33 pg/mL), loss of 260-nm absorbing materials (4.36 and 4.19 optical density), leakage of potassium ions (950 and 1000 mmol/L) and increase in relative electrical conductivity (12.6 and 10.5%) against food-borne pathogenic bacteria <em>L. monocytogenes</em> and <em>E. coli</em>, respectively. These findings propose that <em>C. bonducella</em> oil compromised its mode of action on membrane integrity, suggesting its enormous food and pharmacological potential.</p><p> </p>

scholarly journals The effect of additives metal on the D.C conductivity of epoxy resin

2011 ◽  
Vol 8 (1) ◽  
pp. 168-174
Author(s):  
Baghdad Science Journal
Keyword(s):  
Activation Energy ◽  
Electrical Conductivity ◽  
Epoxy Resin ◽  
Filler Content ◽  
Experimental Results ◽  
Filler Concentration ◽  
Effect Of Additives

The present studies are focused on the modification of the properties of epoxy resin with different additives namely aluminum, copper by preparing of composites systems with percentage (20%, 40% and 50%) of the above additives. The experimental results show that the D.C of conductivity on wt% filler content at ( 293-413 ) K electrical conductivity of all above composites increased with temperature for composites with filler contact and find the excellent electrical conductivity of copper and lie between (2.6*10-10 - 2.1*10-10)?.cm . The activation energy of the electrical conductivity is determined and found to decrease with increasing the filler concentration.

Design and Fabrication of Micro Oxygen Sensor

2011 ◽  
Vol 483 ◽  
pp. 237-242
Author(s):  
Chia Yen Lee ◽  
Long Kai Lin Liou ◽  
Chin Lung Chang ◽  
Chang Hsing Tai ◽  
Lung Ming Fu
Keyword(s):  
Thin Film ◽  
Electrical Conductivity ◽  
Gas Sensor ◽  
Oxygen Sensor ◽  
Rf Sputtering ◽  
Experimental Results ◽  
Surface Pattern ◽  
Working Temperature ◽  
Measured Resistance ◽  
Sensing Performance

In the study, a MEMS-based gas sensor is presented, which consists of a sensing thin film deposited by RF sputtering and annealed at 375°C. The structure and surface pattern of the thin film are analyzed by XRD and SEM. The sensor consists of a substrate, Pt interdigitated electrodes and an SnO2 sensing layer. As concentration of oxygen changes, a change in the electrical conductivity of the SnO2 film is caused. The experimental results show that the measured resistance increases as the concentration of oxygen increases at a working temperature of 300°C. A good oxygen sensing performance is presented in the study.

Effect of Electrical Pulse Ageing on Microstructure and Properties of Cu-2.5Fe-0.03P-0.1Zn Copper Alloy

2005 ◽  
Vol 475-479 ◽  
pp. 2635-2638
Author(s):  
Jin Liang Huang ◽  
Qiang Li ◽  
Ping Liu ◽  
Qi Ming Dong
Keyword(s):  
Electrical Conductivity ◽  
Theoretical Analysis ◽  
Copper Alloy ◽  
High Density ◽  
Experimental Results ◽  
Electrical Pulse ◽  
Lead Frame ◽  
Microstructure And Properties ◽  
Nano Size ◽  
The Ideal

Milisecond high density electrical pulse was used to age one of the typical IC lead frame materials Cu-2.5Fe-0.03P-0.1Zn copper alloy. The effects of electrical pulse aging on the microstructures, electrical conductivity and microhardness of this alloy were systematically investigated. The experimental results shown that the alloy phase precipitated in Cu-2.5Fe-0.03P-0.1Zn copper alloy during electrical pulse aging could be controlled to the order of nano-size and the ideal match of electrical conductivity and microhardness could be achieved in the condition of optimized parameters of electrical pulse. The electrical conductivity of the alloy was kept at above 60%IACS while the microhardness reached to HV115. A preliminary theoretical analysis was made to explain the unique action of electrical pulse.

scholarly journals Preparation and Study of some Electrical Properties of PVA-Ni(NO3)2 Composites

2014 ◽  
Vol 40 ◽  
pp. 36-42 ◽  
Author(s):  
Sabah A. Salman ◽  
Nabeel A. Bakr ◽  
Mohammed H. Mahmood
Keyword(s):  
Activation Energy ◽  
Electrical Conductivity ◽  
Electrical Properties ◽  
Filler Content ◽  
Experimental Results ◽  
Casting Technique ◽  
Different Temperatures

The aim of this paper is to prepare and study the (D.C.) electrical conductivity of (PVA-Ni (NO3)2) composites at different temperatures. For that purpose, PVA films with Ni (NO3)2 salt additive were prepared with different concentrations‎ 2, 4, 6, 8 and 10 wt. % and with thickness of 45μm by using casting technique. The experimental results for PVA-Ni (NO3)2) ‎films show that the (D.C.) electrical‏ ‏conductivity increased with increasing ‎the filler content and the‏ ‏temperature, and the activation energy was ‎decreased with increasing the filler content‎.

scholarly journals QTL-Seq identifies quantitative trait loci of relative electrical conductivity associated with heat tolerance in bottle gourd (Lagenaria siceraria)

PLoS ONE ◽  
2020 ◽  
Vol 15 (11) ◽  
pp. e0227663
Author(s):  
Hui Song ◽  
Yunping Huang ◽  
Binquan Gu
Keyword(s):  
Electrical Conductivity ◽  
Quantitative Trait Loci ◽  
Heat Tolerance ◽  
Quantitative Trait ◽  
Bottle Gourd ◽  
High Temperature Treatment ◽  
Lagenaria Siceraria ◽  
Trait Loci ◽  
Heat Tolerant ◽  
Relative Electrical Conductivity

Heat is a major abiotic stress that seriously affects watermelon (Citrullus lanatus) production. However, its effects may be mitigated through grafting watermelon to heat tolerant bottle gourd (Lagenaria siceraria) rootstocks. Understanding the genetic basis of heat tolerance and development of reliable DNA markers to indirectly select for the trait are necessary in breeding for new varieties with heat tolerance. The objectives of this study were to investigate the inheritance of heat tolerance and identify molecular markers associated with heat tolerance in bottle gourd. A segregating F2 population was developed from a cross between two heat tolerant and sensitive inbred lines. The population was phenotyped for relative electrical conductivity (REC) upon high temperature treatment which was used as an indicator for heat tolerance. QTL-seq was performed to identify regions associated with heat tolerance. We found that REC-based heat tolerance in this population exhibited recessive inheritance. Seven heat-tolerant quantitative trait loci (qHT1.1, qHT2.1, qHT2.2, qHT5.1, qHT6.1, qHT7.1, and qHT8.1) were identified with qHT2.1 being a promising major-effect QTL. In the qHT2.1 region, we identified three non-synonymous SNPs that were potentially associated with heat tolerance. These SNPs were located in the genes that may play roles in pollen sterility, intracellular transport, and signal recognition. Association of the three SNPs with heat tolerance was verified in segregating F2 populations, which could be candidate markers for marker assisted selection for heat tolerance in bottle gourd. The qHT2.1 region is an important finding that may be used for fine mapping and discovery of novel genes associated with heat tolerance in bottle gourd.

scholarly journals The electrical and mechanical properties of Cadmium chloride reinforced PVA:PVP blend films

2020 ◽  
Vol 12 ◽  
pp. 120006
Author(s):  
Rana S. Mahmood ◽  
Sabah A. Salman ◽  
Nabeel Ali Bakr
Keyword(s):  
Mechanical Properties ◽  
Electrical Conductivity ◽  
Polymer Blend ◽  
Weight Ratio ◽  
Experimental Results ◽  
Casting Method ◽  
Ac Electrical Conductivity ◽  
Elongation At Break ◽  
Blend Films ◽  
Reinforced Polymer

In this study, pure polymer blend (PVA:PVP) film and salt (CdCl2·H2O) reinforced polymer blend films were prepared at different weight ratios (10 wt%, 20 wt%, 40 wt%) using the casting method. The effect of the salt weight ratio on the dielectric properties of the polymer blend films reinforced by CdCl2·H2O salt were investigated, and the experimental results showed that the dielectric constant and the dielectric loss factor decreased as the frequency increased for all polymer blend films. Moreover, the above-mentioned properties increased with increasing salt weight ratios at the same frequency. The experimental results also showed an increase in AC electrical conductivity with increasing frequency, for all polymer blend films, and the AC electrical conductivity also increased with an increase in the weight ratio of the salt at the same frequency. The effect of the salt weight ratio on the mechanical properties of the salt-reinforced PVA:PVP polymer blend films was also studied. The experimental results obtained from the tensile test of the salt-reinforced polymer blend films show significant change in the values of tensile strength, elongation at break, and Young’s modulus with increasing salt weight ratios; the hardness value first increases then decreases with increasing salt weight ratios, and the fracture energy value increases with increasing salt weight ratios, thus they could be good candidates for hard adhesives with low flexibility.

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