Low temperature UV laser etching of PMMA: On the mechanism of ablative photodecomposition (APD)

1986 ◽  
Vol 24 (8) ◽  
pp. 371-376 ◽  
Author(s):  
B. Braren ◽  
D. Seeger
1987 ◽  
Vol 101 ◽  
Author(s):  
J. Flicstein ◽  
J.E. Bouree ◽  
J.F. Bresse ◽  
A.M. Pougnet

ABSTRACTThe rates of aluminum line growth, assisted by photolysis, in the normal direction to the Si (100) substrate, indicate that, in a trimethyl-aluminum + hydrogen mixture, only the change in the TMA flux and the UV laser power can play a determinant role. Possible explanation is based on the generated methyl radical “blocking” action leading to a self-limiting deposition rate, as opposed to the enhancement of methyl desorption by hydrogenation to methane. It is shown that dilution by hydrogen decreases the carbon contamination in aluminum line.


2000 ◽  
Vol 46 (2) ◽  
pp. 32-41 ◽  
Author(s):  
Wilson Wong ◽  
Kwong Chan ◽  
Kwok Wing Yeung ◽  
Kai Shui Lau

Author(s):  
J. Simpson ◽  
I. Hauksson ◽  
S.Y. Wang ◽  
H. Stewart ◽  
K.A. Prior ◽  
...  

1986 ◽  
Vol 90 ◽  
Author(s):  
S J C Irvine ◽  
J B Mullin ◽  
G W Blackmore ◽  
O D Dosser ◽  
H Hill

ABSTRACTMechanisms for the low temperature photo-dissociation of alkyl precursors for the epitaxial growth of CdxHg1-xTe (CMT) are discussed. The roles of vapour and surface nucleation are considered in the light of the free radical model which also can provide methods for controlling the vapour phase photochemistry. Higher quality CMT has been grown at 250 °C by using dimethyl mercury as a source of free methyl radicals. Problems encountered in reducing growth temperature for multilayer epitaxy are considered for CdTe and HgTe and conditions established for epitaxial growth at 200°C.The roles of alkyl concentration, substrate temperature, UV intensity and free radical concentration are explored. Results on the first reported growth of CdTe deposition using a cw UV laser source are compared with the arc lamp grown layers.


1993 ◽  
Vol 185 (1-4) ◽  
pp. 164-168 ◽  
Author(s):  
J. Simpson ◽  
I. Hauksson ◽  
S.Y. Wang ◽  
H. Stewart ◽  
K.A. Prior ◽  
...  

2012 ◽  
Vol 212 (2) ◽  
pp. 492-496 ◽  
Author(s):  
Yu-Tang Dai ◽  
Gang Xu ◽  
Xin-Lin Tong

1986 ◽  
Vol 75 ◽  
Author(s):  
Gary L. Loper ◽  
Martin D. Tabat

AbstractUltraviolet laser-induced, radical-etching processes developed by us can provide practical etch rates and selectivities for most of the important film layer combinations used in silicon microelectronic devices. These processes have been demonstrated in simple proximity and projection exposure experiments to produce etch features on surfaces with dimensions of a few tenths of a micrometer.Mechanistic studies suggest that, in our etching processes for polysilicon and molybdenum, fluorine atoms responsible for etching are primarily produced from the precursors COF2 and NF3 on the surface rather than in the gas phase. The predominant production process appears to be photodecomposition of surface adsorbed precursor. Contributions due to precursor pyrolysis or precursor reaction with photogenerated charge carriers are found to be unimportant.


1983 ◽  
Vol 29 ◽  
Author(s):  
M. L. Lloyd ◽  
K. G. Ibbs

ABSTRACTUV laser photochemical doping offers the possibility of direct fabrication of semiconductor devices by high-intensity photolithographic projection. We have recently demonstrated control of parameters such as dopant concentration and junction depth to the extent that npn structures can be readily produced.Recent work also indicates that contact resistance can be dramatically reduced from the levels found using simple probes, by the low-temperature laser deposition of metals, and that this technique also can be used to connect elements in a circuit.In this paper the progress made towards the fabrication of complete planar devices is described and the I-V characteristics of some simple diodes are shown.


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