Physical aging studies in epoxy resins. I. Kinetics of the enthalpy relaxation process in a fully cured epoxy resin

1994 ◽  
Vol 32 (3) ◽  
pp. 509-522 ◽  
Author(s):  
S. Montserrat
2012 ◽  
Vol 557-559 ◽  
pp. 1479-1482
Author(s):  
Yao Liu ◽  
Cong De Qiao ◽  
Jin Shui Yao ◽  
Wen Ke Yang

The relaxation behaviors of PS below Tg and its variation trend along with aging time were studied by DSC, fluorescence spectrum and XRD. On the basis of DSC results, the kinetics of the volume and enthalpy relaxation process were analyzed, and the influence of the aging time on the relaxation behaviors were discussed. The results of fluorescence spectrum and XRD indicated the presence of the rearrangement of polymer chains in the physical aging of polystyrene.


2005 ◽  
Vol 98 (5) ◽  
pp. 2003-2008 ◽  
Author(s):  
F. Fraga ◽  
C. Castro-Díaz ◽  
E. Rodríguez-Núñez ◽  
J. M. Martínez-Ageitos

RSC Advances ◽  
2015 ◽  
Vol 5 (50) ◽  
pp. 40269-40282 ◽  
Author(s):  
Xianyun Gong ◽  
Hongjun Kang ◽  
Yuyan Liu ◽  
Songquan Wu

A reaction mechanism based on the homolysis of the bonds of epoxy resins system in near-critical water was discussed. Based on the observed information, a probable macroscopic mechanism was proposed.


2017 ◽  
Vol 30 (3) ◽  
pp. 303-311 ◽  
Author(s):  
Chao Chen ◽  
Yanxia Li ◽  
Yizhuo Gu ◽  
Min Li ◽  
Zuoguang Zhang

The curing kinetics of two different types of commercial epoxy resins were investigated by means of nonisothermal differential scanning calorimetry (DSC) in this work. The complex curve of measured heat flow of CYCOM 970 epoxy resin was simplified with the method of resolution of peak. Two typical autocatalytic curing reaction curves were gained and the kinetic parameters of the curing process were demonstrated by combination of those two reactions. The Kissinger method was adopted to obtain the values of the activation energy. The parameters of curing kinetic model were acquired according to the fitting of Kamal model. Isothermal DSC curve of CYCOM 970 epoxy resin obtained using the experimental data shows a good agreement with that theoretically calculated. Then, 603 epoxy resin was investigated by the simplified method and the kinetic parameters were received through the same procedure. The nonisothermal DSC curve tested according to the recommended cure cycle of 603 epoxy resin is also consistent with the calculated results. This improved simplified approach provides an effective method to analyze the curing kinetics of the epoxy resins with complex DSC curves as similar to this study.


1992 ◽  
Vol 4 (1) ◽  
pp. 41-48 ◽  
Author(s):  
R. M. V. G. K. Rao ◽  
A. Padma ◽  
H. S. Patel

Differential scanning calorimeny was used to study the cure kinetics of three epoxy resin systems cured with two hardeners: diaminodiphenylmethane (DDM) and a poly (keto-amine) (PA). The results showved that the curing of the epoxy resins by PA occurs at higher temperatures and the activation energy for PA curing was higher compared with the DDM curing process, showing the er reactivity of PA.


1992 ◽  
Vol 25 (18) ◽  
pp. 4658-4664 ◽  
Author(s):  
C. B. McGowan ◽  
D. Y. Kim ◽  
R. B. Blumstein

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