Kinetic Studies on Epoxy Resins Cured with a Novel Polyamine

1992 ◽  
Vol 4 (1) ◽  
pp. 41-48 ◽  
Author(s):  
R. M. V. G. K. Rao ◽  
A. Padma ◽  
H. S. Patel
Keyword(s):  
Activation Energy ◽  
Epoxy Resin ◽  
Epoxy Resins ◽  
Kinetic Studies ◽  
Cure Kinetics ◽  
Curing Process ◽  
Kinetics Of

Differential scanning calorimeny was used to study the cure kinetics of three epoxy resin systems cured with two hardeners: diaminodiphenylmethane (DDM) and a poly (keto-amine) (PA). The results showved that the curing of the epoxy resins by PA occurs at higher temperatures and the activation energy for PA curing was higher compared with the DDM curing process, showing the er reactivity of PA.

scholarly journals Cure Kinetics and Activation Energy Studies of Modified Bismaleimide Resins

2012 ◽  
Vol 2012 ◽  
pp. 1-8 ◽  
Author(s):  
M. Satheesh Chandran ◽  
M. Krishna ◽  
Sheshappa Rai ◽  
M. S. Krupashankara ◽  
K. Salini
Keyword(s):  
Activation Energy ◽  
Cure Kinetics ◽  
Curing Process ◽  
Bismaleimide Resin ◽  
Chain Extenders ◽  
Bismaleimide Resins ◽  
Dsc Method ◽  
Percentage Conversion ◽  
Kinetics Of ◽  
Kinetics And Activation Energy

The cure kinetics and activation energy (Ea) of bismaleimide homopolymer and modified bismaleimide resin systems with different chain extenders were investigated. The bismaleimide resin under investigation was bismaleimidodiphenyl methane (BMPM) and the chain extenders were (i) O-O′ diallyl bisphenol A (DABA) and (ii) methylenedianiline (MDA). Dynamic multiheating DSC method was used to study the kinetics of the curing process. Activation energies were determined for both unmodified and modified resins from nonisothermal multiheating rate DSC tests by using Ozawa and Kissinger models. Activation energy for BMPM homopolymer increased from 95 kJ/mol to 125 kJ/mol as a function of conversion. For the MDA-modified system the activation energy was independent of percentage conversion, at 108 kJ/mol. In the case of DABA-modified bismaleimide the activation energy increased steadily at 6 kJ/mol from 10 to 100% conversion.

Investigating the relationship between tack and degree of conversion in DGEBA-based epoxy resin cured with dicyandiamide and diuron

2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Ali Kuliaei ◽  
Iraj Amiri Amraei ◽  
Seyed Rasoul Mousavi
Keyword(s):  
Epoxy Resin ◽  
Reaction Order ◽  
Theoretical Data ◽  
Cure Kinetics ◽  
Diglycidyl Ether ◽  
Degree Of Conversion ◽  
Ozawa Method ◽  
Heating Rates ◽  
Scanning Calorimetry ◽  
Kinetics Of

Abstract The purpose behind this research was to determine the optimum formulation and investigate the cure kinetics of a diglycidyl ether of bisphenol-A (DGEBA)-based epoxy resin cured by dicyandiamide and diuron for use in prepregs. First, all formulations were examined by the tensile test, and then, the specimens with higher mechanical properties were further investigated by viscometry and tack tests. The cure kinetics of the best formulation (based on tack test) in nonisothermal mode was investigated using differential scanning calorimetry at different heating rates. Kissinger and Ozawa method was used for determining the kinetic parameters of the curing process. The activation energy obtained by this method was 71.43 kJ/mol. The heating rate had no significant effect on the reaction order and the total reaction order was approximately constant ( m + n ≅ 2.1 $m+n\cong 2.1$ ). By comparing the experimental data and the theoretical data obtained by Kissinger and Ozawa method, a good agreement was seen between them. By increasing the degree of conversion, the viscosity decreased; as the degree of conversion increased, so did the slope of viscosity. The results of the tack test also indicated that the highest tack could be obtained with 25% progress of curing.

Cure kinetics of epoxy resin and thermoplastic polymer

2006 ◽  
Vol 86 (3) ◽  
pp. 699-705 ◽  
Author(s):  
Marta Sánchez-Cabezudo ◽  
Margarita G. Prolongo ◽  
Catalina Salom ◽  
Rosa M. Masegosa
Keyword(s):  
Epoxy Resin ◽  
Cure Kinetics ◽  
Thermoplastic Polymer ◽  
Kinetics Of

Cure Kinetics of Epoxy Resin System Toughened by Polyhexamethylene Carbonate Diol

1997 ◽  
Vol 13 (09) ◽  
pp. 848-852
Author(s):  
Chen Tong-Hui ◽  
◽  
Bai Yao-Wen ◽  
Sun Ren-Hui
Keyword(s):  
Epoxy Resin ◽  
Cure Kinetics ◽  
Resin System ◽  
Epoxy Resin System ◽  
Kinetics Of

Warpage Behaviors of System-in-Packages on a Substrate Strip

2018 ◽  
Vol 2018 (1) ◽  
pp. 000344-000348
Author(s):  
Eric Ouyang ◽  
Billy Ahn ◽  
SeonMo Gu ◽  
Jim Hsu ◽  
Yonghyuk Jeong ◽  
...  
Keyword(s):  
Material Characterization ◽  
Epoxy Resins ◽  
Curing Process ◽  
Molding Compound ◽  
Advanced Material ◽  
Curing Reaction ◽  
Different Types ◽  
The Impact ◽  
Compound Materials ◽  
Kinetics Of

Abstract In this paper, the impact of two different types of warpage, strip warpage and system-in-packages (SiP) module warpage, are considered and studied, both experimentally and numerically. An advanced material characterization method is also conducted to study the curing reaction and Pressure-Volume-Temperature-Cure (PVTC) kinetics of the packages. The curing reaction of epoxy resins, as a function of temperature and activation energies, is experimentally determined. During the curing process, the viscosity of epoxy resins change with temperature and conversion rate. The Castro-Macosko model is adopted to describe the rheological properties of epoxy resins. Experimentally, we have prepared substrate strip samples with different component density and molding compound materials. Each substrate strip contains eighteen system-in-packages. The warpages of all substrate strips and all the system-in-package modules were measured, compared, and correlated.

Cure kinetics of ternary blends of epoxy resins studied by nonisothermal DSC data

2009 ◽  
Vol 112 (5) ◽  
pp. 3119-3126 ◽  
Author(s):  
Garima Tripathi ◽  
Deepak Srivastava
Keyword(s):  
Epoxy Resins ◽  
Cure Kinetics ◽  
Ternary Blends ◽  
Kinetics Of

Cure kinetics of biphenyl epoxy resin system using latent catalysts

2001 ◽  
Vol 81 (11) ◽  
pp. 2711-2720 ◽  
Author(s):  
Whan Gun Kim ◽  
Ho Gyu Yoon ◽  
Jun Young Lee
Keyword(s):  
Epoxy Resin ◽  
Cure Kinetics ◽  
Resin System ◽  
Epoxy Resin System ◽  
Kinetics Of
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